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CC3100MODR11MAMOBR
Texas Instruments
IC RF TXRX+MCU WIFI 63SMD
1963 Pcs New Original In Stock
IC RF TxRx + MCU WiFi 802.11b/g/n 2.4GHz 63-SMD Module
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5.0 / 5.0
- (311 Ratings)
CC3100MODR11MAMOBR
Product Overview
1252191
DiGi Electronics Part Number
CC3100MODR11MAMOBR-DGManufacturer
Texas Instruments
CC3100MODR11MAMOBR
Description
IC RF TXRX+MCU WIFI 63SMDInventory
1963 Pcs New Original In Stock
IC RF TxRx + MCU WiFi 802.11b/g/n 2.4GHz 63-SMD Module
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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CC3100MODR11MAMOBR Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SimpleLink™
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
WiFi
Protocol
802.11b/g/n
Modulation
-
Frequency
2.4GHz
Data Rate (Max)
16Mbps
Power - Output
17dBm
Sensitivity
-95dBm
Memory Size
-
Serial Interfaces
SPI
Voltage - Supply
2.3V ~ 3.6V
Current - Receiving
54mA
Current - Transmitting
223mA
Operating Temperature
-20°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
63-SMD Module
Supplier Device Package
63-QFM (20.5x17.5)
Base Product Number
CC3100
Datasheet & Documents
Manufacturer Product Page
CC3100MODR11MAMOBR Specifications
HTML Datasheet
CC3100MODR11MAMOBR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8473.30.1180
Additional Information
Other Names
-CC3100MODR11MAMOBR-NDR
296-43589-1
296-43589-2
2156-CC3100MODR11MAMOBRTR
CC3100MODR11MAMOBR-DG
-296-43589-1-DG
296-43589-6
Standard Package
750
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
가격이 좋아서 계속 이용하는데, 배송도 항상 빠르고 안전해서 좋아요.
грудня 02, 2025
실시간 배송 추적이 가능해서 불안감 없이 기다릴 수 있고, 언제든 상태를 확인할 수 있어 좋아요.
грудня 02, 2025
J’ai été impressionné par leur amabilité et par leurs prix très compétitifs.
грудня 02, 2025
Leur rapidité et leur professionnalisme en after-sales support sont impressionnants.
грудня 02, 2025
I feel confident using DiGi Electronics' products because I know they are built to last and won't cause unexpected issues.
грудня 02, 2025
DiGi Electronics demonstrates excellent inventory management, always ensuring product availability without overstocking.
грудня 02, 2025
From quality to delivery speed, everything was seamless and satisfying.
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Frequently Asked Questions (FAQ)
When designing the CC3100MODR11MAMOBR into a battery-powered IoT sensor node, what are the key power-saving trade-offs between deep sleep modes and wake-up latency for reliable WiFi reconnection?
The CC3100MODR11MAMOBR supports multiple low-power modes including Hibernate and Standby, but full reconnection from hibernate can take up to 400ms due to full network renegotiation. For battery-critical applications, use Standby mode with retained SPI context to reduce wake-up latency to ~20ms, accepting slightly higher quiescent current. Always validate wakeup timing with the host MCU’s interrupt handling to prevent missed packets or connection timeouts.
How does the CC3100MODR11MAMOBR handle RF interference in crowded 2.4GHz environments, and what PCB layout practices minimize performance degradation in industrial IoT deployments?
The CC3100MODR11MAMOBR employs dynamic channel selection and adaptive data rate scaling, but performance may degrade in high-interference zones (e.g., near Bluetooth or microwave sources). To mitigate this, isolate the antenna zone with ≥3mm clearance from digital traces, use a full ground plane under the 63-QFM module, and avoid placing metal enclosures directly above the integrated ceramic antenna. Consider external antenna variants (e.g., CC3200MOD) if multipath fading is observed.
Can the CC3100MODR11MAMOBR replace the ESP8266-12F in an existing design, and what are the critical integration risks regarding GPIO availability, security features, and firmware over-the-air updates?
While both support 2.4GHz WiFi, the CC3100MODR11MAMOBR offers superior hardware security (WPA3-ready, embedded crypto accelerators) and better ESD robustness compared to the ESP8266-12F, but has fewer exposed GPIOs via the SPI interface. Replacing ESP8266 requires redesigning for indirect GPIO control through the SimpleLink™ MCU abstraction layer. Also, ensure host MCU has ≥128KB RAM to buffer TI’s network stack updates, unlike ESP’s integrated SDK approach.
What are the implications of the CC3100MODR11MAMOBR's 17dBm transmit power and -95dBm sensitivity on link budget in a multi-floor smart building application, and how can packet loss be minimized?
With 112dB link margin (17dBm - (-95dBm)), the CC3100MODR11MAMOBR supports reliable communication over ~50m indoors, but real-world performance drops with concrete walls. For multi-floor deployments, reduce packet size to 128 bytes and enable automatic rate fallback in the SimpleLink™ API to maintain connections at edge locations. Use RSSI monitoring in your firmware to trigger early handoff or mesh forwarding decisions.
How does the 63-QFM package of the CC3100MODR11MAMOBR impact thermal management and long-term reliability in sealed enclosures operating near the 70°C upper limit?
The 63-QFM package has limited thermal pad exposure; sustained TX at 223mA current under 70°C ambient can push junction temperature near limits. For sealed enclosures, use a thermal via array under the ground pad connected to inner layer copper pours and avoid placing the module near other heat sources. Derate max duty cycle to 60% during continuous transmission to ensure >10-year MTBF in industrial conditions.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
CC3100MODR11MAMOBR CAD Models
Texas Instruments CC3100MODR11MAMOBR PCB symbols & footprints
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