CC1101RTKR >
CC1101RTKR
Texas Instruments
IC RF TXRX ISM<1GHZ 20VFQFN
8963 Pcs New Original In Stock
IC RF TxRx Only General ISM < 1GHz 300MHz ~ 348MHz, 387MHz ~ 464MHz, 779MHz ~ 928MHz 20-VFQFN Exposed Pad
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CC1101RTKR Texas Instruments
5.0 / 5.0 - (383 Ratings)

CC1101RTKR

Product Overview

1274138

DiGi Electronics Part Number

CC1101RTKR-DG

Manufacturer

Texas Instruments
CC1101RTKR

Description

IC RF TXRX ISM<1GHZ 20VFQFN

Inventory

8963 Pcs New Original In Stock
IC RF TxRx Only General ISM < 1GHz 300MHz ~ 348MHz, 387MHz ~ 464MHz, 779MHz ~ 928MHz 20-VFQFN Exposed Pad
Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 0.8116 0.8116
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CC1101RTKR Technical Specifications

Category RF Transceiver ICs

Manufacturer Texas Instruments

Packaging -

Series -

Product Status Obsolete

DiGi-Electronics Programmable Not Verified

Type TxRx Only

RF Family/Standard General ISM < 1GHz

Protocol -

Modulation 2FSK, 4FSK, ASK, GFSK, MSK, OOK

Frequency 300MHz ~ 348MHz, 387MHz ~ 464MHz, 779MHz ~ 928MHz

Data Rate (Max) 600kbps

Power - Output 12dBm

Sensitivity -116dBm

Memory Size -

Serial Interfaces SPI

Voltage - Supply 1.8V ~ 3.6V

Current - Receiving 14.3mA ~ 17.1mA

Current - Transmitting 12.3mA ~ 34.2mA

Operating Temperature -40°C ~ 85°C

Mounting Type Surface Mount

Package / Case 20-VFQFN Exposed Pad

Supplier Device Package 20-QFN (4x4)

Base Product Number CC1101

Datasheet & Documents

HTML Datasheet

CC1101RTKR-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991G
HTSUS 8542.39.0001

Additional Information

Other Names
-CC1101RTKRG3
296-21981-2
296-21981-6-NDR
-296-21981-1-NDR
296-21981-1
-CC1101RTKRG3-NDR
296-21981-6
-296-21981-1
296-21981-2-NDR
-CC1101RTKR-NDR
-296-21981-1-DG
296-21981-1-NDR
Standard Package
3,000

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
CC1101RGPR
Texas Instruments
65139
CC1101RGPR-DG
0.0074
Direct

Reviews

5.0/5.0-(Show up to 5 Ratings)
바***소
грудня 02, 2025
5.0
다양한 제품과 세심한 고객 서비스 덕분에 항상 만족하고 있습니다.
心***步
грудня 02, 2025
5.0
客服的反應速度讓我非常驚喜,解決我疑問的速度真是神速!
Chan***DeMer
грудня 02, 2025
5.0
Une entreprise qui mise sur la satisfaction client avec un support after-sales performant.
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грудня 02, 2025
5.0
Bei DiGi Electronics fühle ich mich durch den schnellen Versand und den guten Support sehr gut aufgehoben.
Bliss***Heart
грудня 02, 2025
5.0
Their after-sales team responded swiftly, resolving my concerns with professionalism.
Pu***oy
грудня 02, 2025
5.0
I trust their products because they never compromise on quality or price clarity.
Drea***aver
грудня 02, 2025
5.0
I trust their durability; their products have reliably lasted through my testing phases.
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грудня 02, 2025
5.0
I love how quickly I can locate products thanks to the well-organized categories and search function.
Morn***Glow
грудня 02, 2025
5.0
The packaging kept the product’s integrity intact, and it stands out for its toughness.
Pur***iss
грудня 02, 2025
5.0
Their efficient support after a sale ensures continuous operational flow for my team.
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Frequently Asked Questions (FAQ)

What are the key design risks when replacing the obsolete CC1101RTKR in a new low-power ISM band sensor node, and how should I evaluate alternatives like the CC1101RGPR?

The CC1101RTKR is obsolete, so designing it into new products introduces supply chain and longevity risks. While the CC1101RGPR appears functionally identical—same frequency bands, modulation schemes, SPI interface, and pinout—it uses a different package (20-QFN 5x5 vs. 4x4) and may have slight variations in thermal performance or assembly requirements. Before substitution, verify footprint compatibility, reflow profile tolerance, and confirm that your PCB layout accommodates the larger thermal pad. Also validate firmware compatibility, as register defaults or calibration routines might differ subtly. Always test RF performance (sensitivity, output power) across your target frequency band under real-world conditions to ensure no degradation in link budget.

Can I use the CC1101RTKR in a battery-powered remote sensor operating at 315MHz with intermittent 500kbps data bursts, and what are the hidden power consumption pitfalls?

Yes, the CC1101RTKR supports 315MHz operation and can handle 500kbps data rates using GFSK or 4FSK modulation. However, its transmit current can spike up to 34.2mA at 12dBm output, which significantly impacts battery life if duty cycling isn’t tightly controlled. A critical but non-obvious risk is the startup time from sleep mode (~2ms typical); frequent wake-ups for short transmissions waste energy waiting for PLL stabilization. To mitigate this, batch data transmissions, use the lowest acceptable output power, and leverage the built-in FIFO to minimize active time. Also ensure your MCU SPI timing aligns with the CC1101RTKR’s timing requirements to avoid unnecessary retries or extended active states.

How does the CC1101RTKR compare to the newer CC1310 in terms of integration, cost, and long-term reliability for a 433MHz industrial telemetry application?

The CC1101RTKR is a standalone RF transceiver requiring an external MCU, while the CC1310 integrates an ARM Cortex-M3 MCU, richer peripherals, and lower sleep current—making it better suited for future-proof, space-constrained designs. For a 433MHz telemetry system, the CC1310 offers superior energy efficiency (<1µA in shutdown) and enhanced RF performance with better adjacent channel rejection. However, the CC1101RTKR may still be viable if you already have a capable MCU and prioritize lower BOM cost. The major trade-off is long-term availability: since the CC1101RTKR is obsolete, sourcing could become unreliable, whereas the CC1310 is actively supported by TI with extended lifecycle commitments. Always assess total system cost, not just component price.

What layout and grounding mistakes commonly cause RF performance degradation when designing with the CC1101RTKR in a 2-layer PCB, and how can I avoid them?

A common mistake is inadequate grounding under the CC1101RTKR’s exposed thermal pad, which acts as the primary RF ground reference. On a 2-layer board, failing to stitch the pad directly to a solid ground plane with multiple vias leads to impedance mismatches, reduced sensitivity, and unstable output power. Additionally, placing digital traces (especially SPI lines) too close to the RF input/output pins can couple noise and degrade -116dBm sensitivity. Always route the antenna matching network first, keep it compact, and isolate it from digital sections. Use a continuous ground pour on the bottom layer and add ground vias around the CC1101RTKR perimeter. Avoid splitting the ground plane beneath the device—this is critical for stable oscillator and PA performance.

Is it safe to operate the CC1101RTKR at 3.6V supply voltage in an automotive environment where temperature swings from -30°C to 80°C, and what reliability concerns should I anticipate?

While the CC1101RTKR’s absolute maximum supply is 3.6V and its operating range includes -40°C to 85°C, running continuously at 3.6V near the upper temperature limit increases long-term reliability risks due to electromigration and accelerated aging of the internal LDO and RF circuitry. In automotive applications, voltage transients (load dumps) can exceed 3.6V even if nominal supply is 3.3V. To mitigate this, use a robust LDO with overvoltage protection and consider derating the supply to 3.3V or lower. Also ensure your PCB has proper thermal management—the 20-VFQFN package relies on the PCB for heat dissipation. Monitor for gradual sensitivity degradation over time, which could indicate oxide wearout in the receiver front-end under sustained high-voltage, high-temperature stress.

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