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MLG1005S3N9ST000
TDK Corporation
FIXED IND 3.9NH 700MA 200MOHM SM
225414 Pcs New Original In Stock
3.9 nH Unshielded Multilayer Inductor 700 mA 200mOhm Max 0402 (1005 Metric)
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5.0 / 5.0
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MLG1005S3N9ST000
Product Overview
6650101
DiGi Electronics Part Number
MLG1005S3N9ST000-DGManufacturer
TDK Corporation
MLG1005S3N9ST000
Description
FIXED IND 3.9NH 700MA 200MOHM SMInventory
225414 Pcs New Original In Stock
3.9 nH Unshielded Multilayer Inductor 700 mA 200mOhm Max 0402 (1005 Metric)
Quantity
Minimum 1
Minimum 1
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MLG1005S3N9ST000 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
MLG
Product Status
Active
Type
Multilayer
Material - Core
Ceramic, Non-Magnetic
Inductance
3.9 nH
Tolerance
±0.3nH
Current Rating (Amps)
700 mA
Current - Saturation (Isat)
-
Shielding
Unshielded
DC Resistance (DCR)
200mOhm Max
Q @ Freq
8 @ 100MHz
Frequency - Self Resonant
5GHz
Ratings
-
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
100 MHz
Mounting Type
Surface Mount
Package / Case
0402 (1005 Metric)
Supplier Device Package
0402 (1005 Metric)
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Height - Seated (Max)
0.022" (0.55mm)
Datasheet & Documents
HTML Datasheet
MLG1005S3N9ST000-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Other Names
445-3049-1
445-3049-2
MLG1005S3N9S
MLG1005S3N9ST
445-3049-6
Standard Package
10,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
Les conseillers chez DiGi Electronics sont incroyablement professionnels et aimables.
грудня 02, 2025
Sehr benutzerfreundlich gestaltet, erleichtert mir die tägliche Arbeit erheblich.
грудня 02, 2025
The reliability of DiGi Electronics’ equipment has significantly reduced our maintenance costs.
грудня 02, 2025
They have an excellent track record of delivering on time, which is crucial for my development projects.
грудня 02, 2025
We trust their support team to handle our requests efficiently, minimizing operational disruption.
грудня 02, 2025
I appreciate their proactive communication and prompt delivery services.
грудня 02, 2025
Their commitment to quality is evident in every aspect of their products.
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Frequently Asked Questions (FAQ)
Can the MLG1005S3N9ST000 replace a shielded inductor like the Murata LQW15AN3N9D00D in a high-density RF front-end design, and what are the risks of using an unshielded part in close proximity to sensitive analog traces?
The MLG1005S3N9ST000 is an unshielded multilayer ceramic inductor, so direct replacement of a shielded wire-wound inductor like the Murata LQW15AN3N9D00D introduces EMI and crosstalk risks. While both offer 3.9 nH inductance, the unshielded construction of the MLG1005S3N9ST000 can radiate magnetic fields, potentially coupling noise into adjacent high-impedance nodes or receive paths in RF circuits. If space constraints prevent adequate spacing (>3× component height), consider adding a grounded guard trace or localized shielding. For designs with tight layout and low noise margins, a shielded alternative such as TDK’s own MHQ1005P series may be safer despite larger footprint.
How does the absence of a specified saturation current (Isat) on the MLG1005S3N9ST000 affect reliability in a 5G mmWave power amplifier bias network operating near 700 mA peak current?
The MLG1005S3N9ST000 does not specify a saturation current because it uses a non-magnetic ceramic core, which inherently avoids magnetic saturation—unlike ferrite-based inductors. However, the 700 mA current rating refers to thermal limits (I_RMS), not magnetic performance. In a 5G mmWave PA bias tee, transient current spikes or duty-cycle variations could push RMS current beyond safe levels, causing localized heating and potential resistance drift. To mitigate risk, validate actual RMS current under worst-case modulation (e.g., 64-QAM or OFDM peaks) and ensure PCB copper area under the 0402 package provides adequate thermal dissipation. Monitor for inductance shift during thermal cycling, as ceramic materials can exhibit microcracking under repeated stress.
Is the MLG1005S3N9ST000 suitable for use in a 28 GHz phased-array antenna matching network where Q factor and parasitic stability are critical, given its Q of only 8 @ 100 MHz?
While the MLG1005S3N9ST000 has a low Q of 8 at 100 MHz, its performance at 28 GHz is dominated by parasitic capacitance and self-resonant behavior rather than core losses. With a self-resonant frequency of 5 GHz, the part operates well beyond resonance at 28 GHz, effectively behaving as a capacitor—making it unsuitable for resonant matching at that frequency. For mmWave applications, consider air-core or thin-film inductors with SRF > 30 GHz, such as Coilcraft’s 0201CS series. If used below 2 GHz (e.g., for DC biasing), the MLG1005S3N9ST000 is acceptable, but never in the signal path above its SRF without full S-parameter validation.
What are the long-term reliability concerns when using the MLG1005S3N9ST000 in automotive under-hood applications exposed to temperature cycling from -40°C to +125°C, despite its rated -55°C to +125°C range?
Although the MLG1005S3N9ST000 is rated for -55°C to +125°C, automotive under-hood environments involve rapid thermal cycling and mechanical stress that can fatigue the brittle ceramic multilayer structure. Repeated expansion/contraction between the inductor and PCB (CTE mismatch) may lead to microcracks, increasing DCR or causing open circuits over time. To enhance reliability, use conformal coating to reduce moisture ingress and mechanical strain, and avoid placing the component near high-stress areas like board edges or mounting holes. Additionally, conduct HAST (Highly Accelerated Stress Test) or thermal cycle testing (-40°C ↔ +125°C, 1000 cycles) during qualification to validate field durability, especially if replacing a more robust wire-wound or molded inductor.
Can I substitute the MLG1005S3N9ST000 with the Samsung CL05A3N9KA5NNNC in a Bluetooth Low Energy (BLE) matching network, and what layout considerations are critical due to differences in construction and parasitics?
The Samsung CL05A3N9KA5NNNC is a comparable 3.9 nH ±0.1 nH multilayer inductor in 0402 packaging, but it has a lower DCR (150 mΩ typical vs. 200 mΩ max for MLG1005S3N9ST000) and potentially different parasitic capacitance due to internal electrode geometry. While electrically similar at BLE frequencies (2.4 GHz), the substitution requires validation of impedance match and insertion loss using network analyzer measurements or EM simulation. Critical layout considerations include maintaining identical pad geometry, minimizing trace stubs, and ensuring symmetrical grounding to preserve Q and SRF behavior. Avoid mixing vendors in production unless both parts are qualified under the same RF load conditions, as subtle parasitic differences can detune matching networks and reduce radiated efficiency.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MLG1005S3N9ST000 CAD Models
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