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MLG0603P4N1BT000
TDK Corporation
FIXED IND 4.1NH 350MA 400MOHM SM
170445 Pcs New Original In Stock
4.1 nH Unshielded Multilayer Inductor 350 mA 400mOhm Max 0201 (0603 Metric)
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5.0 / 5.0
- (290 Ratings)
MLG0603P4N1BT000
Product Overview
6651357
DiGi Electronics Part Number
MLG0603P4N1BT000-DGManufacturer
TDK Corporation
MLG0603P4N1BT000
Description
FIXED IND 4.1NH 350MA 400MOHM SMInventory
170445 Pcs New Original In Stock
4.1 nH Unshielded Multilayer Inductor 350 mA 400mOhm Max 0201 (0603 Metric)
Quantity
Minimum 1
Minimum 1
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MLG0603P4N1BT000 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
MLG-P
Product Status
Active
Type
Multilayer
Material - Core
Non-Magnetic
Inductance
4.1 nH
Tolerance
±0.1nH
Current Rating (Amps)
350 mA
Current - Saturation (Isat)
-
Shielding
Unshielded
DC Resistance (DCR)
400mOhm Max
Q @ Freq
14 @ 500MHz
Frequency - Self Resonant
5.8GHz
Ratings
-
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
500 MHz
Mounting Type
Surface Mount
Package / Case
0201 (0603 Metric)
Supplier Device Package
0201 (0603 Metric)
Size / Dimension
0.024" L x 0.012" W (0.60mm x 0.30mm)
Height - Seated (Max)
0.013" (0.33mm)
Datasheet & Documents
HTML Datasheet
MLG0603P4N1BT000-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Standard Package
15,000
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
문의도 빠르게 답변해주시고, 배송도 신속하게 처리되어서 감사합니다.
грудня 02, 2025
Ich war begeistert von den günstigen Preisen und der geduldigen, hilfsbereiten Art des Kundenservice-Teams.
грудня 02, 2025
ウェブサイトのナビゲーションが良く、初めてでも迷わず使えました。
грудня 02, 2025
DiGi Electronicsの物流は非常に効率的です。注文から届くまでの時間が短く、ビジネスにも役立ちました。
грудня 02, 2025
DiGi Electronics consistently surpasses expectations with their inventory practices.
грудня 02, 2025
Fast shipping, coupled with attentive support, makes shopping with DiGi Electronics a pleasure.
грудня 02, 2025
Shipping process is transparent, and updates are timely.
грудня 02, 2025
Fast shipping and a very proactive after-sales team made my experience wonderful.
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Frequently Asked Questions (FAQ)
How does the MLG0603P4N1BT000 inductor's unshielded design impact EMI in high-density RF layouts and what design precautions should be taken?
The MLG0603P4N1BT000's unshielded multilayer construction can couple magnetically with adjacent components in compact RF designs, increasing crosstalk and EMI risk. To mitigate this, maintain a minimum spacing of 1.5x the component length (≥0.9mm) from sensitive traces or other inductors. Avoid placing high-impedance nodes or feedback paths underneath or alongside the MLG0603P4N1BT000. Use ground shielding vias around the RF signal path—though not directly under the inductor—to reduce field spread. Consider switching to a shielded alternative like the Murata LQP03TN4N1B02D if EMI is critical in your module design.
Can the MLG0603P4N1BT000 reliably replace the ATFC-0201HQ-3N9B-T in 5G front-end modules, and what are the key parameter trade-offs?
While the MLG0603P4N1BT000 and ATFC-0201HQ-3N9B-T both target 0201 RF applications, direct replacement requires caution. The MLG0603P4N1BT000 offers slightly higher inductance (4.1nH vs. 3.9nH), a tighter tolerance (±0.1nH), and better DCR (400mΩ max) but lacks published saturation current (Isat), making it less suitable for power-conducting paths. The ATFC part has better documented thermal performance under load. For low-signal filtering or impedance matching in 5G NR bands (n77/n79), the MLG0603P4N1BT000 is acceptable, but verify thermal rise under sustained RF drive. Avoid substitution in PA bias chokes or matching nets with DC offset.
What are the solder reflow profile risks for the MLG0603P4N1BT000 at high-volume assembly, and how can micro-cracking be prevented?
The MLG0603P4N1BT000's 0201 (0603 metric) size and ceramic multilayer structure make it prone to solder joint micro-cracking under thermal-mechanical stress during reflow. To reduce risk, use a controlled ramp rate (≤2°C/sec) and avoid thermal shock during peak temperatures (recommended peak: 240–250°C). Ensure PCB coplanarity and minimize board flex during conveyance. Use solder paste volume optimized for 0201 to prevent tombstoning. Consider no-clean, low-residue pastes to avoid whisker formation. For high-reliability applications, perform post-reflow AOI and periodic cross-section analysis.
How does the self-resonant frequency (SRF) of 5.8GHz in the MLG0603P4N1BT000 affect its usability in 5.8GHz Wi-Fi and mmWave applications?
The MLG0603P4N1BT000 has a self-resonant frequency (SRF) of 5.8GHz, which limits its effective inductive behavior just at the edge of the 5.8GHz Wi-Fi band. Operating near SRF reduces inductor Q-factor and introduces capacitive phase shift, degrading performance in matching networks. For reliable use, the rule of thumb is to operate below 80% of SRF (ideally <4.6GHz). In 5.8GHz systems, the MLG0603P4N1BT000 can be used only in non-critical, low-impedance roles like DC blocking or bypass, but should be avoided in resonant tank circuits or tuned filters. For higher SRF needs, consider the Taiyo Yuden HK Series HK060304NK-T, rated for >6GHz SRF.
What are the long-term reliability concerns when using MLG0603P4N1BT000 in automotive RF applications near the maximum 125°C operating temperature?
In automotive environments, operating the MLG0603P4N1BT000 near its 125°C upper limit accelerates thermal aging and increases DCR over time due to prolonged current exposure. Although the MLG0603P4N1BT000 is rated for this temperature, prolonged operation above 105°C can reduce effective Q and inductance stability, especially when handling average currents above 250mA. Derate current by at least 30% for continuous operation above 100°C. Implement thermal vias under adjacent ground pads to enhance heat dissipation. Given no Isat specification, avoid use in power lines with transient surges. For under-hood applications, consider accelerated life testing to validate field reliability.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MLG0603P4N1BT000 CAD Models
TDK Corporation MLG0603P4N1BT000 PCB symbols & footprints
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