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MLG0603P1N2BT000
TDK Corporation
FIXED IND 1.2NH 800MA 80MOHM SMD
155370 Pcs New Original In Stock
1.2 nH Unshielded Multilayer Inductor 800 mA 80mOhm Max 0201 (0603 Metric)
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5.0 / 5.0
- (339 Ratings)
MLG0603P1N2BT000
Product Overview
6647727
DiGi Electronics Part Number
MLG0603P1N2BT000-DGManufacturer
TDK Corporation
MLG0603P1N2BT000
Description
FIXED IND 1.2NH 800MA 80MOHM SMDInventory
155370 Pcs New Original In Stock
1.2 nH Unshielded Multilayer Inductor 800 mA 80mOhm Max 0201 (0603 Metric)
Quantity
Minimum 1
Minimum 1
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MLG0603P1N2BT000 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
MLG-P
Product Status
Active
Type
Multilayer
Material - Core
Non-Magnetic
Inductance
1.2 nH
Tolerance
±0.1nH
Current Rating (Amps)
800 mA
Current - Saturation (Isat)
-
Shielding
Unshielded
DC Resistance (DCR)
80mOhm Max
Q @ Freq
14 @ 500MHz
Frequency - Self Resonant
10GHz
Ratings
-
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
500 MHz
Mounting Type
Surface Mount
Package / Case
0201 (0603 Metric)
Supplier Device Package
0201 (0603 Metric)
Size / Dimension
0.024" L x 0.012" W (0.60mm x 0.30mm)
Height - Seated (Max)
0.013" (0.33mm)
Datasheet & Documents
HTML Datasheet
MLG0603P1N2BT000-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Other Names
445-MLG0603P1N2BT000TR
445-MLG0603P1N2BT000DKR
MLG0603P1N2BT000-DG
445-MLG0603P1N2BT000CT
Standard Package
15,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
적극적인 고객지원으로 제품 선택부터 문제 해결까지 모두 만족했습니다. 가격도 경쟁력 있어 계속 이용할 계획입니다.
грудня 02, 2025
배송이 빨라서 좋았고, 고객 지원도 친절했어요.
грудня 02, 2025
Très satisfait, la rapidité est remarquable et la qualité est au rendez-vous.
грудня 02, 2025
梱包がしっかりしていて、商品が完璧な状態で届きました。
грудня 02, 2025
商品の発送連絡も早く、追跡情報も明確だったため、予定通りに受け取ることができました。
грудня 02, 2025
The responsiveness of DiGi Electronics’ support team greatly improves my remote working efficiency.
грудня 02, 2025
I always appreciate their consistent on-time delivery; it shows their commitment to customer satisfaction.
грудня 02, 2025
I appreciate their proactive approach to customer feedback and continuous improvement.
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Frequently Asked Questions (FAQ)
What are the key reliability risks when using the MLG0603P1N2BT000 in high-density RF PCB layouts with tight component spacing?
The MLG0603P1N2BT000 is an unshielded multilayer inductor in a 0201 package, making it susceptible to magnetic coupling with adjacent components in high-density layouts. Without shielding, nearby power traces or inductors can induce unwanted mutual inductance, degrading RF performance. To mitigate this, maintain at least 2–3 times the component width (≥0.6 mm) spacing from other magnetic or high-current elements, and orient it perpendicular to nearby inductors. Additionally, ground plane placement directly beneath the device should be avoided to prevent eddy current losses, which can reduce Q-factor and shift self-resonant frequency.
Can the MLG0603P1N2BT000 be directly replaced with a shielded inductor like the Murata LQW04AN1R2C00D in a 5G front-end matching network?
While the Murata LQW04AN1R2C00D (1.2 nH, 0402, shielded) offers better EMI containment, it is not a drop-in replacement for the MLG0603P1N2BT000 due to package size (0402 vs. 0201), higher DCR (~120 mΩ), and different parasitic profile. The MLG0603P1N2BT000’s ultra-compact 0201 footprint and lower DCR (80 mΩ max) make it preferable for space-constrained, low-loss RF paths. If EMI is a concern, consider relocating sensitive traces or adding localized shielding instead of upsizing the inductor, which could require impedance re-tuning and board respins.
How does the absence of a saturation current rating (Isat) on the MLG0603P1N2BT000 affect its use in power-sensitive RF bias tees or DC-feed applications?
The MLG0603P1N2BT000 lacks a specified saturation current because it uses a non-magnetic core, which inherently does not saturate like ferrite-based inductors. This makes it ideal for DC-feed applications where stable inductance under bias current is critical—such as in RF amplifier bias tees—since inductance remains flat up to its 800 mA current rating. However, designers must still ensure total DC current (including peak RF-induced currents) stays below 800 mA to avoid thermal runaway due to I²R losses, especially given its small 0201 thermal mass.
What layout and grounding practices are critical when integrating the MLG0603P1N2BT000 into a 28 GHz mmWave antenna matching circuit to avoid unintended resonances?
At 28 GHz, the MLG0603P1N2BT000’s parasitic capacitance and pad layout dominate performance. Its self-resonant frequency (10 GHz) is below the operating band, so it behaves capacitively above that point—requiring careful impedance modeling. Use electromagnetic (EM) simulation to capture pad and trace parasitics. Minimize solder pad size to reduce capacitance, avoid ground planes within 0.3 mm beneath the component, and use grounded coplanar waveguide (GCPW) routing with precise 50 Ω trace width. Any stub or via near the inductor can create stub resonances; thus, place it directly in the signal path with minimal discontinuity.
Is the MLG0603P1N2BT000 suitable for automotive-grade RF modules operating under temperature cycling from -40°C to +125°C, and how does its tolerance impact production yield?
Yes, the MLG0603P1N2BT000 is rated for -55°C to +125°C and is RoHS3 compliant, making it suitable for automotive environments. However, its ±0.1 nH tolerance (≈±8.3% at 1.2 nH) is tighter than standard ±5% or ±10% inductors, which improves matching accuracy but requires precise process control during assembly. In high-volume production, this tight tolerance reduces tuning needs but increases sensitivity to solder paste volume and reflow profile. Recommend using automated optical inspection (AOI) and controlled reflow to prevent tombstoning (due to 0201 size), and validate impedance across temperature in pilot runs to ensure consistent performance under thermal stress.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MLG0603P1N2BT000 CAD Models
TDK Corporation MLG0603P1N2BT000 PCB symbols & footprints
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