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MLG0603P13NHT000
TDK Corporation
FIXED IND 13NH 250MA 1.1 OHM SMD
155274 Pcs New Original In Stock
13 nH Unshielded Multilayer Inductor 250 mA 1.1Ohm Max 0201 (0603 Metric)
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5.0 / 5.0
- (431 Ratings)
MLG0603P13NHT000
Product Overview
6655876
DiGi Electronics Part Number
MLG0603P13NHT000-DGManufacturer
TDK Corporation
MLG0603P13NHT000
Description
FIXED IND 13NH 250MA 1.1 OHM SMDInventory
155274 Pcs New Original In Stock
13 nH Unshielded Multilayer Inductor 250 mA 1.1Ohm Max 0201 (0603 Metric)
Quantity
Minimum 1
Minimum 1
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MLG0603P13NHT000 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
MLG-P
Product Status
Active
Type
Multilayer
Material - Core
Non-Magnetic
Inductance
13 nH
Tolerance
±3%
Current Rating (Amps)
250 mA
Current - Saturation (Isat)
-
Shielding
Unshielded
DC Resistance (DCR)
1.1Ohm Max
Q @ Freq
14 @ 500MHz
Frequency - Self Resonant
3.2GHz
Ratings
-
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
500 MHz
Mounting Type
Surface Mount
Package / Case
0201 (0603 Metric)
Supplier Device Package
0201 (0603 Metric)
Size / Dimension
0.024" L x 0.012" W (0.60mm x 0.30mm)
Height - Seated (Max)
0.013" (0.33mm)
Datasheet & Documents
HTML Datasheet
MLG0603P13NHT000-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Other Names
445-MLG0603P13NHT000TR
MLG0603P13NHT000-DG
445-MLG0603P13NHT000CT
445-MLG0603P13NHT000DKR
Standard Package
15,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
상담원의 응대가 정중하고 상세했어요. 구매 과정에서도 확신이 들었습니다.
грудня 02, 2025
注文後すぐに発送され、待つことなく商品が手元に届きました。
грудня 02, 2025
I was impressed with how quickly my order was shipped. Absolutely no delay!
грудня 02, 2025
Their support team’s professionalism makes resolving issues quick and easy.
грудня 02, 2025
Every time I shop at DiGi Electronics, I find their prices to be fair and clearly communicated, enhancing my trust.
грудня 02, 2025
The honesty in pricing and the consistency in product performance are what stand out most.
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Frequently Asked Questions (FAQ)
Can the MLG0603P13NHT000 multilayer inductor be safely used in a 2.4 GHz RF matching network given its unshielded construction and small 0201 footprint?
While the MLG0603P13NHT000 has a self-resonant frequency of 3.2 GHz—above 2.4 GHz—its unshielded design makes it susceptible to electromagnetic coupling with nearby traces or components in dense layouts. In RF matching networks, this can lead to unintended signal leakage or detuning. For best results, maintain at least 0.5 mm clearance from adjacent conductive elements and avoid routing high-speed digital lines beneath or parallel to the inductor. If board space allows, consider a shielded alternative like the TDK MLF0603A13NJT000 for improved isolation, though the MLG0603P13NHT000 remains viable with careful layout and grounding.
Is the MLG0603P13NHT000 suitable as a drop-in replacement for the Murata LQP03TN13N00D in a 5G mmWave front-end bias tee circuit operating at 500 MHz?
The MLG0603P13NHT000 and Murata LQP03TN13N00D both offer 13 nH inductance in 0201 packages, but key differences affect compatibility. The Murata part is shielded and has a lower DCR (0.45 Ω typical vs. 1.1 Ω max for the MLG0603P13NHT000), which impacts insertion loss in bias tees. Additionally, the MLG0603P13NHT000’s non-magnetic core avoids saturation issues in high-field environments, but its unshielded nature may introduce noise coupling in sensitive mmWave paths. Only consider direct replacement if your layout includes sufficient isolation and DC current stays below 200 mA to minimize resistive losses—otherwise, re-evaluate impedance matching and thermal performance.
What are the reliability risks of using the MLG0603P13NHT000 in automotive under-hood applications where ambient temperatures reach 120°C and vibration is present?
The MLG0603P13NHT000 is rated for operation up to 125°C, so it technically meets the temperature requirement. However, its 0201 package is among the smallest surface-mount inductors and is more prone to solder joint fatigue under sustained thermal cycling and mechanical vibration. In automotive under-hood environments, repeated expansion/contraction can lead to microcracks. To mitigate risk, use a robust solder paste (e.g., SAC305 with Ni doping), ensure proper pad design with adequate solder fillets, and consider conformal coating. For mission-critical systems, evaluate a larger, more mechanically robust inductor such as the MLG1005S13NJT000 (0402 size) or add strain relief via layout symmetry.
How does the Q factor of the MLG0603P13NHT000 at 500 MHz (Q = 14) impact efficiency in a Class-E RF power amplifier, and can it handle peak currents above 250 mA without degrading inductance?
With a Q of only 14 @ 500 MHz, the MLG0603P13NHT000 exhibits relatively high parasitic losses, which reduce overall efficiency in Class-E amplifiers where reactive components must store and release energy with minimal dissipation. While the 250 mA rating is continuous RMS, peak currents in Class-E topologies can exceed this during switching transients. Since the MLG0603P13NHT000 lacks a specified saturation current (Isat), prolonged peaks above 250 mA may cause temporary inductance drop due to core hysteresis, distorting waveform timing. For reliable operation, limit peak current to ≤200 mA or select an inductor with published Isat (e.g., Coilcraft 0201CS-13N) if your design demands higher transient handling.
Can I parallel two MLG0603P13NHT000 inductors to achieve ~6.5 nH and increase current handling in a compact DC-DC converter output filter, and what layout pitfalls should I avoid?
Paralleling two MLG0603P13NHT000 inductors theoretically yields ~6.5 nH with doubled current capacity, but practical implementation introduces significant risks. Due to manufacturing tolerances (±3% each), inductance mismatch can cause uneven current sharing, overloading one component. Additionally, the unshielded construction increases mutual coupling between adjacent parts, potentially creating resonant loops or reducing effective inductance. If you must parallel them, place the inductors orthogonally (90° orientation) with ≥1 mm spacing and use a star-point connection to minimize shared impedance. However, a single, purpose-built low-inductance part like the TDK MLG0603P6N8HT000 (6.8 nH, 300 mA) is strongly preferred for stability and space efficiency.
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