MLF1608A4R7JT000 >
MLF1608A4R7JT000
TDK Corporation
FIXED IND 4.7UH 30MA 1.6 OHM SMD
149163 Pcs New Original In Stock
4.7 µH Shielded Multilayer Inductor 30 mA 1.6Ohm Max 0603 (1608 Metric)
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MLF1608A4R7JT000 TDK Corporation
5.0 / 5.0 - (358 Ratings)

MLF1608A4R7JT000

Product Overview

6655970

DiGi Electronics Part Number

MLF1608A4R7JT000-DG

Manufacturer

TDK Corporation
MLF1608A4R7JT000

Description

FIXED IND 4.7UH 30MA 1.6 OHM SMD

Inventory

149163 Pcs New Original In Stock
4.7 µH Shielded Multilayer Inductor 30 mA 1.6Ohm Max 0603 (1608 Metric)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 20 0.0343 0.6860
  • 200 0.0275 5.5000
  • 600 0.0238 14.2800
  • 4000 0.0216 86.4000
  • 8000 0.0197 157.6000
  • 20000 0.0186 372.0000
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MLF1608A4R7JT000 Technical Specifications

Category Fixed Inductors

Manufacturer TDK

Packaging Tape & Reel (TR)

Series MLF

Product Status Active

Type Multilayer

Material - Core Ferrite

Inductance 4.7 µH

Tolerance ±5%

Current Rating (Amps) 30 mA

Current - Saturation (Isat) -

Shielding Shielded

DC Resistance (DCR) 1.6Ohm Max

Q @ Freq 35 @ 10MHz

Frequency - Self Resonant 55MHz

Ratings -

Operating Temperature -40°C ~ 85°C

Inductance Frequency - Test 10 MHz

Mounting Type Surface Mount

Package / Case 0603 (1608 Metric)

Supplier Device Package 0603 (1608 Metric)

Size / Dimension 0.063" L x 0.031" W (1.60mm x 0.80mm)

Height - Seated (Max) 0.037" (0.95mm)

Datasheet & Documents

HTML Datasheet

MLF1608A4R7JT000-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.50.8000

Additional Information

Other Names
MLF1608A4R7J
445-181323-1
445-181323-2
445-MLF1608A4R7JT000DKR
MLF1608A4R7J-DG
445-181323-2-DG
445-181323-1-DG
MLF1608A4R7JT000-DG
445-MLF1608A4R7JT000CT
445-MLF1608A4R7JT000TR
Standard Package
4,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
햇***로
грудня 02, 2025
5.0
배송이 빠르고, 제품에 문제가 없도록 세심하게 관리해 주셔서 감사해요.
포***불
грудня 02, 2025
5.0
이 회사의 고객 서비스는 정말 전문적이에요. 문의할 때마다 빠르고 친절하게 대답해 줍니다.
Flamme***assion
грудня 02, 2025
5.0
J’ai toujours été impressionné par la diligence de leur service après-vente, vraiment rassurant.
Rêv***Fée
грудня 02, 2025
5.0
DiGi Electronics propose des prix très compétitifs tout en assurant un support après-vente de premier ordre.
風***詩
грудня 02, 2025
5.0
購入後のアフターサービスが非常に丁寧で、安心してお任せできます。
ゆう***はね
грудня 02, 2025
5.0
丁寧な仕事ぶりと親切なサポートに感謝しています。信頼のブランドです。
Ech***bes
грудня 02, 2025
5.0
The complete packaging ensures products are received without damage.
Vivid***izons
грудня 02, 2025
5.0
Customer support is available through multiple channels, making assistance very accessible.
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Frequently Asked Questions (FAQ)

Can the MLF1608A4R7JT000 be used in high-frequency DC-DC converters near its self-resonant frequency of 55MHz, and what design risks should be considered?

The MLF1608A4R7JT000 has a self-resonant frequency (SRF) of 55MHz, which limits its effective usable range in DC-DC converters. Operating near or above SRF causes inductive reactance to shift to capacitive, degrading filtering performance and increasing output ripple. For reliable operation, ensure the switching frequency is no higher than 70% of SRF—ideally ≤38MHz. Additionally, parasitic capacitance variations due to PCB layout or voltage bias can lower effective SRF. To mitigate risk, include layout margining and verify impedance with network analyzer testing in the final design if operating above 30MHz.

How does the MLF1608A4R7JT000 compare to the Murata LQM21PN4R7MGRL in high-Q RF applications at 10MHz?

The MLF1608A4R7JT000 offers a Q value of 35 at 10MHz, comparable to the Murata LQM21PN4R7MGRL (Q ≈ 38 at 10MHz), making both suitable for mid-frequency RF filters or impedance matching. However, the Murata part typically exhibits lower DCR (~1.2Ω vs. 1.6Ω max) and tighter manufacturing control in high-volume production. Choose the MLF1608A4R7JT000 when cost and availability are critical, but consider the Murata alternative where minimizing insertion loss or thermal rise in dense RF front-ends is a priority. Validate with end-use signal integrity testing due to subtle core material differences.

What are the reliability risks of using the MLF1608A4R7JT000 in automotive environments with thermal cycling between -40°C and 85°C?

The MLF1608A4R7JT000 is rated for -40°C to 85°C operation, which meets basic automotive cabin requirements but may risk long-term reliability in under-hood applications with frequent thermal cycling. The ferrite core and multilayer structure can develop microcracks due to CTE mismatch with the PCB, especially with board flexure or lead-free reflow stress. To mitigate failure risk, ensure compliant PCB mounting, avoid point loads, and verify performance after 1000+ thermal cycles in qualification testing. For under-hood use, consider higher-grade parts with AEC-Q200 certification as alternatives.

Is the MLF1608A4R7JT000 a viable drop-in replacement for the discontinued Taiyo Yuden BLM18AG4R7SN1 in noise suppression for low-current signal lines?

The MLF1608A4R7JT000 can serve as a functional replacement for the BLM18AG4R7SN1 in low-current filtering (≤30mA) with similar 4.7µH inductance and 0603 footprint, but key differences exist. The MLF part has higher DCR (1.6Ω max vs. ~1.1Ω), which may increase DC loss in sensitive analog paths. Additionally, shielding performance and high-frequency impedance profiles differ due to core materials—verify EMI attenuation above 50MHz with current probe measurements. Use the MLF1608A4R7JT000 only after re-characterizing filter response in the target circuit, especially in high-noise environments.

What PCB layout guidelines should be followed when integrating the MLF1608A4R7JT000 to minimize EMI and thermal issues in dense SMD designs?

When laying out the MLF1608A4R7JT000 in compact PCBs, maintain at least 0.3mm clearance to adjacent conductors to prevent fringe field coupling, as it is shielded but not fully immune. Use symmetric, wide traces (≥0.2mm) for thermal dissipation and current handling, avoiding thermal vias directly under the pad to prevent solder wicking. Ensure a solid ground plane beneath but not directly under the inductor to reduce eddy currents. Avoid placing sensitive traces (e.g., feedback lines) within 1.5mm underneath or alongside. Finally, verify post-layout with near-field EMI scanning if used in RF-sensitive devices to detect unexpected coupling.

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