Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
MHQ1005P3N3BT000
TDK Corporation
FIXED IND 3.3NH 900MA 80MOHM SMD
99691 Pcs New Original In Stock
3.3 nH Unshielded Multilayer Inductor 900 mA 80mOhm Max 0402 (1005 Metric)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (139 Ratings)
MHQ1005P3N3BT000
Product Overview
6647465
DiGi Electronics Part Number
MHQ1005P3N3BT000-DGManufacturer
TDK Corporation
MHQ1005P3N3BT000
Description
FIXED IND 3.3NH 900MA 80MOHM SMDInventory
99691 Pcs New Original In Stock
3.3 nH Unshielded Multilayer Inductor 900 mA 80mOhm Max 0402 (1005 Metric)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
MHQ1005P3N3BT000 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
MHQ-P
Product Status
Active
Type
Multilayer
Material - Core
Ceramic, Non-Magnetic
Inductance
3.3 nH
Tolerance
±0.1nH
Current Rating (Amps)
900 mA
Current - Saturation (Isat)
-
Shielding
Unshielded
DC Resistance (DCR)
80mOhm Max
Q @ Freq
23 @ 250MHz
Frequency - Self Resonant
6GHz
Ratings
-
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
100 MHz
Mounting Type
Surface Mount
Package / Case
0402 (1005 Metric)
Supplier Device Package
0402 (1005 Metric)
Size / Dimension
0.039" L x 0.024" W (1.00mm x 0.60mm)
Height - Seated (Max)
0.024" (0.60mm)
Datasheet & Documents
HTML Datasheet
MHQ1005P3N3BT000-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Other Names
MHQ1005P3N3BT000-DG
445-MHQ1005P3N3BT000TR
445-MHQ1005P3N3BT000CT
445-MHQ1005P3N3BT000DKR
Standard Package
10,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
Leur souci du détail dans l'emballage est remarquable.
грудня 02, 2025
The website's layout is clean, organized, and easy to explore.
грудня 02, 2025
Speedy delivery and top quality make them stand out.
грудня 02, 2025
DiGi Electronics offers a fantastic variety of products, making it easy to find exactly what I need.
грудня 02, 2025
The staff was friendly and professional, making every interaction pleasant.
грудня 02, 2025
Their cost-effective solutions exceed my expectations for quality and reliability.
грудня 02, 2025
They offer a great balance between cost and support quality, which is rare.
грудня 02, 2025
Their logistics system is well-organized, leading to consistent on-time delivery.
грудня 02, 2025
I appreciate the careful and secure packaging that DiGi Electronics provides.
грудня 02, 2025
My order was dispatched quickly, and I received it ahead of schedule.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the key design risks when using the MHQ1005P3N3BT000 in a high-frequency RF matching network above 2 GHz?
When using the MHQ1005P3N3BT000 in RF matching circuits above 2 GHz, the primary risk is parasitic resonance due to its 6 GHz self-resonant frequency — operation too close to this point can cause unpredictable impedance shifts. Since the component is unshielded, coupling with adjacent traces or components can also degrade performance. To mitigate, maintain tight layout control: minimize trace lengths, avoid ground plane coupling beneath the inductor, and verify impedance with network analysis at operating frequency. Use the measured Q of 23 at 250 MHz as a baseline but expect reduced Q in-band; simulate with actual PCB stack-up models to avoid mistuning.
Can the MHQ1005P3N3BT000 replace the Murata LQP03TN3N3B02 in ultra-compact 5G front-end modules, and what integration trade-offs should be considered?
Yes, the MHQ1005P3N3BT000 can serve as a functional alternative to the Murata LQP03TN3N3B02, both being 3.3nH, 0402-size unshielded multilayer inductors. However, the TDK part offers lower DCR (80mΩ max vs. 100mΩ) and comparable Q, which may improve insertion loss in bias feed lines. The key trade-off is tolerance: MHQ1005P3N3BT000 has ±0.1nH precision, tighter than Murata's ±0.2nH, enhancing repeatability in production. But as both are unshielded, co-placement with LNA or PA stages risks crosstalk. Always validate with EM simulation and thermal imaging, especially under 900mA load conditions.
How does the unshielded construction of the MHQ1005P3N3BT000 impact EMI performance in dense RF layouts, and what layout precautions are recommended?
The unshielded ceramic core of the MHQ1005P3N3BT000 makes it susceptible to magnetic coupling in high-density RF designs, potentially increasing crosstalk or detuning nearby resonant circuits. To minimize EMI risks, orient the inductor with its long axis perpendicular to adjacent signal lines, maintain at least 2x component length (2mm) spacing from sensitive nodes, and avoid placing it near clock lines or antennas. Use localized ground guard rings (with no via stitching directly under the inductor) and consider incorporating thin-film shielding if board-level emissions fail compliance testing.
What thermal and current-handling limitations should be evaluated when using the MHQ1005P3N3BT000 in power amplifier bias chokes?
While the MHQ1005P3N3BT000 is rated for 900 mA DC and has low 80mΩ DCR, its use as a PA bias choke must consider thermal derating in enclosed or high-ambient environments. The absence of shielding reduces thermal mass, increasing temperature rise under continuous load. In 5G mmWave modules operating near 125°C junction temperatures, copper trace conduction and PCB thermal vias become critical for heat dissipation. Designers should perform thermal imaging validation under max load, limit PCB trace length to reduce added resistance, and avoid stacking inductors or placing them near heat-generating components like PAs or PMICs.
What reliability concerns should be addressed when soldering the MHQ1005P3N3BT000 in reflow assembly, given its 0402 (1005 metric) size and MSL1 rating?
Despite the MHQ1005P3N3BT000 having MSL1 (unlimited floor life), its 0402 footprint presents significant tombstoning and misalignment risks during reflow due to asymmetric thermal pads or rapid temperature gradients. To ensure reliability, use balanced land patterns per IPC-7351, apply stencil aperture reductions (to 90% of pad size) to control paste volume, and implement a precise thermal profile with ramp rates under 2°C/sec. Given its tight ±0.1nH tolerance, avoid manual rework; use automated optical inspection (AOI) post-placement to detect skew or insufficient solder joints, especially in high-vibration applications where mechanical stress could compromise long-term integrity.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MHQ1005P3N3BT000 CAD Models
TDK Corporation MHQ1005P3N3BT000 PCB symbols & footprints
productDetail
