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DPX252690DT-5072A1
TDK Corporation
MULTILAYER DIPLEXER FOR LTE
1482 Pcs New Original In Stock
RF Diplexer 617MHz ~ 960MHz / 1.452GHz ~ 2.69GHz 1008 (2520 Metric), 8 PC Pad
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5.0 / 5.0
- (405 Ratings)
DPX252690DT-5072A1
Product Overview
10222434
DiGi Electronics Part Number
DPX252690DT-5072A1-DGManufacturer
TDK Corporation
DPX252690DT-5072A1
Description
MULTILAYER DIPLEXER FOR LTEInventory
1482 Pcs New Original In Stock
RF Diplexer 617MHz ~ 960MHz / 1.452GHz ~ 2.69GHz 1008 (2520 Metric), 8 PC Pad
Quantity
Minimum 1
Minimum 1
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DPX252690DT-5072A1 Technical Specifications
Category
RF Multiplexers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Type
Diplexer
Frequency Bands (Low / High)
617MHz ~ 960MHz / 1.452GHz ~ 2.69GHz
Low Band Attenuation (min / max dB)
30.00dB / 39.00dB
High Band Attenuation (min / max dB)
28.00dB / 38.00dB
Return Loss (Low Band / High Band)
16.0dB / 15.0dB
Mounting Type
Surface Mount
Package / Case
1008 (2520 Metric), 8 PC Pad
Datasheet & Documents
HTML Datasheet
DPX252690DT-5072A1-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Other Names
445-DPX252690DT-5072A1DKR
445-DPX252690DT-5072A1TR
445-DPX252690DT-5072A1CT
Standard Package
2,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
Dank der zuverlässigen Lieferungen von DiGi Electronics konnten wir Produktionsstopps vermeiden.
грудня 02, 2025
This was my first purchase, and I'm very satisfied with the quality.
грудня 02, 2025
Excellent packaging that maintains product integrity during transit.
грудня 02, 2025
Order was shipped promptly, and the tracking updates kept me informed every step of the way.
грудня 02, 2025
Their packaging is not only eco-friendly but also well-designed and sturdy.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when integrating the DPX252690DT-5072A1 into a compact LTE front-end module with tight impedance control?
When integrating the DPX252690DT-5072A1 into space-constrained LTE designs, a major risk is impedance mismatch due to microstrip trace deviations on the PCB. Given its 8-pad SMD layout in a 2520 metric package, parasitic inductance from excessive trace length (>1.5mm) or incorrect pad tapering can degrade return loss below the specified 15–16dB. To mitigate, use controlled-impedance 50Ω microstrips, minimize vias near RF ports, and simulate with EM tools accounting for substrate Dk tolerance (±0.2). Also ensure guard rings isolate LO and RF paths to prevent coupling in dense layouts.
How does the DPX252690DT-5072A1 compare to the Murata LAPD241CC105D in frequency isolation for dual-band LTE applications covering 700MHz and 2.5GHz bands?
The DPX252690DT-5072A1 offers tighter band separation than the Murata LAPD241CC105D, with 30–39dB typical attenuation between 617–960MHz and 1.45–2.69GHz bands, compared to Murata’s 25–32dB. This makes the DPX252690DT-5072A1 better suited for high-aggregation LTE scenarios where Tx leakage from 700MHz band interferes with 2.5GHz Rx sensitivity. However, the Murata part has lower insertion loss (<1.2dB vs. ~1.5dB), so trade-offs exist between isolation and signal integrity. Verify with system-level coexistence testing if adjacent-channel leakage ratio (ACLR) margin is tight.
Can the DPX252690DT-5072A1 be used as a drop-in replacement for the Qorvo DPL9226 in a legacy 4G CPE design, and what layout adjustments are needed?
While the DPX252690DT-5072A1 covers similar frequency ranges (617–960MHz / 1.45–2.69GHz) as the Qorvo DPL9226, it is not a direct footprint replacement—the TDK device uses an 8-pad 2520 layout versus Qorvo’s 6-pin 2012. Redesigning the RF stack-up is required, including grounding via placement and matching network re-optimization. Additionally, DPL9226 has higher power handling (33dBm vs. 30dBm), so validate with high-Pout PA stages. Recalibrate S-parameters and re-run thermal analysis due to different thermal pad dissipation in the DPX252690DT-5072A1.
What reliability issues should be considered when deploying the DPX252690DT-5072A1 in outdoor LTE gateways exposed to thermal cycling from -40°C to +85°C?
In outdoor environments with wide thermal swings, the DPX252690DT-5072A1’s ceramic multilayer structure is robust but still at risk of solder joint fatigue due to CTE mismatch with FR-4 PCBs. Ensure Type I (high-temp) solder paste is used, and avoid placing near high-mass components. The MSL1 rating eliminates pre-bake concerns, but validate long-term reliability with 1000+ thermal cycles (per JESD22-A104) in the design stage. Also monitor passivation cracks under mechanical stress—mount the PCB with compliant grommets if vibration is present.
How can I troubleshoot unexpected high insertion loss in the high band (1.45–2.69GHz) when using the DPX252690DT-5072A1 with a 5G NR sub-6GHz receiver chain?
Unexpected insertion loss in the high band of the DPX252690DT-5072A1 often stems from improper grounding or matching network interactions. Check that all GND pads are connected to a solid ground plane with ≥2 vias per pad (via diameter ≥0.2mm). Use a VNA to de-embed the matching network; if the S21 exceeds 1.8dB, parasitic inductance in the series components (e.g., 0402 inductors) or insufficient capacitor Q-factor may be distorting resonance. Also verify that the Rx filter upstream isn’t overloading the diplexer’s Rx port—signal compression can occur above +10dBm input, degrading effective sensitivity.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
DPX252690DT-5072A1 CAD Models
TDK Corporation DPX252690DT-5072A1 PCB symbols & footprints
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