CDEP1411NP-100MC-95 >
CDEP1411NP-100MC-95
Sumida America Components Inc.
INDUCTOR
6222 Pcs New Original In Stock
10 µH Shielded Wirewound Inductor 9.6 A 8.4mOhm Max Nonstandard
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CDEP1411NP-100MC-95
5.0 / 5.0 - (88 Ratings)

CDEP1411NP-100MC-95

Product Overview

2716591

DiGi Electronics Part Number

CDEP1411NP-100MC-95-DG
CDEP1411NP-100MC-95

Description

INDUCTOR

Inventory

6222 Pcs New Original In Stock
10 µH Shielded Wirewound Inductor 9.6 A 8.4mOhm Max Nonstandard
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 150 1.5362 230.4225
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CDEP1411NP-100MC-95 Technical Specifications

Category Fixed Inductors

Manufacturer Sumida

Packaging Tape & Reel (TR)

Series CDEP1411

Product Status Active

Type Wirewound

Material - Core Ferrite

Inductance 10 µH

Tolerance ±20%

Current Rating (Amps) 9.6 A

Current - Saturation (Isat) 13.1A

Shielding Shielded

DC Resistance (DCR) 8.4mOhm Max

Q @ Freq -

Frequency - Self Resonant -

Ratings -

Operating Temperature -40°C ~ 105°C

Inductance Frequency - Test 100 kHz

Features -

Mounting Type Surface Mount

Package / Case Nonstandard

Supplier Device Package -

Size / Dimension 0.571" L x 0.571" W (14.50mm x 14.50mm)

Height - Seated (Max) 0.472" (12.00mm)

Datasheet & Documents

Environmental & Export Classification

Moisture Sensitivity Level (MSL) 1 (Unlimited)

Additional Information

Other Names
308-CDEP1411NP-100MC-95TR
Standard Package
150

Reviews

5.0/5.0-(Show up to 5 Ratings)
や***り
грудня 02, 2025
5.0
DiGi Electronicsの製品は本当に丈夫で長持ちします。毎日の使用にも全く問題なく、安心して使えます。
Glo***thin
грудня 02, 2025
5.0
DiGi Electronics’ after-sales responsiveness makes them stand out among electronic component suppliers.
Chi***ibes
грудня 02, 2025
5.0
Never having to wait long for stock replenishment makes DiGi Electronics our go-to supplier.
Morn***Glow
грудня 02, 2025
5.0
Their packaging is not only eco-friendly but also creatively designed to minimize waste—very thoughtful.
Ech***ves
грудня 02, 2025
5.0
Their customer support team is friendly, professional, and very helpful every time.
Dre***Daze
грудня 02, 2025
5.0
The after-sales support from DiGi Electronics is top-notch, making them a trustworthy partner.
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Frequently Asked Questions (FAQ)

Can the Sumida CDEP1411NP-100MC-95 inductor safely handle continuous operation at 9.6 A in a high-ambient-temperature environment near its 105°C limit without risking core saturation or premature failure?

While the Sumida CDEP1411NP-100MC-95 is rated for 9.6 A RMS and has a saturation current (Isat) of 13.1 A at 25°C, its actual performance degrades at elevated temperatures. Ferrite core permeability decreases with temperature, which can shift the effective saturation point lower. Operating near 105°C ambient reduces thermal margin, so derating the current by at least 20–30% is recommended in such conditions. Always validate thermal performance with real-world load profiles and consider active cooling or spacing from heat sources to avoid inductance collapse or winding insulation degradation.

Is the Sumida CDEP1411NP-100MC-95 a suitable drop-in replacement for a Würth WE-LQS 744040110 (10 µH, 10.5 A, shielded) in a 48 V to 12 V DC-DC converter running at 500 kHz?

Although both the Sumida CDEP1411NP-100MC-95 and the Würth WE-LQS 744040110 offer similar inductance (10 µH) and current ratings, they are not direct drop-in replacements due to critical differences in DCR, core losses, and high-frequency behavior. The Würth part has a lower DCR (~6.5 mΩ) and is optimized for higher efficiency at 500 kHz, while the CDEP1411NP-100MC-95’s 8.4 mΩ DCR increases conduction losses. Additionally, Sumida’s ferrite formulation may exhibit higher core losses at 500 kHz compared to Würth’s specialized material. Replacing without re-evaluating efficiency, thermal rise, and control loop stability could lead to overheating or suboptimal transient response—bench validation is essential.

How does the mechanical footprint and height of the Sumida CDEP1411NP-100MC-95 impact PCB layout in densely populated power stages, and are there compatibility risks with adjacent components?

The Sumida CDEP1411NP-100MC-95 measures 14.5 mm × 14.5 mm with a seated height of 12.0 mm, making it relatively large for compact designs. Its nonstandard package lacks industry-wide pin compatibility, so automated pick-and-place and stencil design must be verified. The tall profile risks interference with heatsinks, connectors, or shielding cans, especially in layered board stacks. Additionally, the wirewound construction may have protruding wire ends under the mold, requiring clearance checks per IPC-7351. Always perform 3D mechanical interference analysis and ensure solder paste volume is controlled to prevent tombstoning due to asymmetric wetting on large pads.

What are the long-term reliability risks of using the Sumida CDEP1411NP-100MC-95 in automotive under-hood applications where temperature cycling from -40°C to 105°C is common?

The Sumida CDEP1411NP-100MC-95 meets the -40°C to 105°C operating range, but repeated thermal cycling in automotive environments can stress the wire-to-terminal joints and ferrite core due to CTE mismatches between materials. Although MSL 1 indicates unlimited floor life and robust moisture resistance, the nonstandard package may have less proven field reliability than AEC-Q200-qualified alternatives like the Bourns SRN8040TA-100M. For mission-critical under-hood use, consider conformal coating to mitigate microcracking and perform thermal cycle testing (-40°C ↔ 125°C, 1000 cycles) to validate solder joint integrity and inductance stability over time.

When designing a multi-phase buck converter, can multiple Sumida CDEP1411NP-100MC-95 inductors be placed in close proximity without causing mutual coupling or efficiency degradation?

Placing multiple Sumida CDEP1411NP-100MC-95 inductors in close proximity risks magnetic coupling due to their unmarked polarity and lack of directional shielding optimization. Even though they are shielded, fringe fields from the ferrite core can interact, leading to increased ripple, noise, and reduced efficiency—especially in interleaved phases where timing offsets amplify coupling effects. Maintain a center-to-center spacing of at least 1.5× the package width (≥22 mm) or orient them perpendicularly to minimize flux linkage. For high-density designs, consider using coupled inductors or parts with integrated shielding planes; otherwise, perform EMI and thermal scanning to detect unexpected losses or hotspots during prototype validation.

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