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BZT52C3V0S
NextGen Components
DIODE ZENER 3V 200mW SOD-323
6319 Pcs New Original In Stock
Zener Diode 3 V 200 mW ±5% Surface Mount SOD-323
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5.0 / 5.0
- (257 Ratings)
BZT52C3V0S
Product Overview
13242258
DiGi Electronics Part Number
BZT52C3V0S-DGManufacturer
NextGen Components
BZT52C3V0S
Description
DIODE ZENER 3V 200mW SOD-323Inventory
6319 Pcs New Original In Stock
Zener Diode 3 V 200 mW ±5% Surface Mount SOD-323
Quantity
Minimum 1
Minimum 1
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BZT52C3V0S Technical Specifications
Category
Diodes, Zener, Single Zener Diodes
Packaging
Tape & Reel (TR)
Series
BZT52C
Product Status
Active
Voltage - Zener (Nom) (Vz)
3 V
Tolerance
±5%
Power - Max
200 mW
Impedance (Max) (Zzt)
120 Ohms
Current - Reverse Leakage @ Vr
50 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If
900 mV @ 10 mA
Operating Temperature
-55°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
SC-76, SOD-323
Supplier Device Package
SOD-323
Datasheet & Documents
HTML Datasheet
BZT52C3V0S-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.10.0050
Additional Information
Other Names
3372-BZT52C3V0STR
Standard Package
12,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
배송 속도가 정말 빠르고 예상보다 빨리 받았어요.
грудня 02, 2025
Très satisfait de mon achat, la livraison a été exceptionnelle et la qualité toujours au top.
грудня 02, 2025
Livraison express, emballage solide, tout est parfait pour un premier achat.
грудня 02, 2025
Ich schätze die Preisvorteile, die ich durch regelmäßige Einkäufe bei DiGi Electronics erhalte, sehr.
грудня 02, 2025
Affordable options from DiGi Electronics help me innovate without worry.
грудня 02, 2025
Their post-purchase support is reliable and professional, which builds great trust.
грудня 02, 2025
The cost-effectiveness of DiGi Electronics' products is outstanding; I get great value for the price.
грудня 02, 2025
I’ve never waited long for an order, and their support team is superb.
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Frequently Asked Questions (FAQ)
Can the BZT52C3V0S be safely used as a voltage reference in a low-power sensor circuit operating at 3.3V with tight tolerance requirements, given its ±5% Zener voltage specification?
The BZT52C3V0S has a nominal Zener voltage of 3V with ±5% tolerance, meaning the actual breakdown voltage can range from 2.85V to 3.15V. For a 3.3V system requiring precise regulation—such as an analog front-end or ADC reference—this variation may introduce unacceptable error. Consider using a dedicated voltage reference IC (e.g., TL431 or MAX6006) with tighter initial accuracy (±0.5% or better) instead. If cost or space constraints force use of the BZT52C3V0S, implement post-assembly calibration or select units from a single batch with measured binning to reduce variability risk.
What are the thermal derating risks when using the BZT52C3V0S in a compact PCB layout near high-power components, and how does its 200mW power rating impact reliability?
The BZT52C3V0S is rated for 200mW maximum power dissipation in free air, but this assumes ideal thermal conditions per JEDEC standards. In dense layouts with adjacent heat sources or poor copper pour, junction temperature can exceed safe limits even at modest currents. For example, at 10mA Zener current (30mW dissipation), localized heating in a confined space may push the junction above 125°C—well within its -55°C to 150°C range but reducing long-term reliability. Always provide adequate thermal relief, avoid placing under shields or near inductors, and consider derating power by 50% in thermally constrained designs to mitigate premature aging.
Is the BZT52C3V0S a drop-in replacement for the MMSZ5226BT1G in a 3V clamping application, and what performance differences should I expect?
While both the BZT52C3V0S (NextGen Components) and MMSZ5226BT1G (ON Semiconductor) are 3V, 200mW Zener diodes in SOD-323 packages, they are not fully interchangeable without validation. The MMSZ5226BT1G typically has lower dynamic impedance (Zzt ≈ 20Ω vs. 120Ω for BZT52C3V0S), resulting in sharper regulation and better transient response. Additionally, reverse leakage current differs: MMSZ5226BT1G leaks <0.5µA @ 1V, whereas BZT52C3V0S allows up to 50µA. In high-impedance or low-leakage circuits (e.g., battery-powered monitoring), this difference can affect accuracy. Only substitute if your design tolerates higher impedance and leakage—otherwise, requalify the circuit or stick with the original part.
How does the BZT52C3V0S perform under repetitive transient overvoltage conditions, such as ESD or load dump events, and is it suitable for automotive-grade input protection?
The BZT52C3V0S is not designed for sustained or high-energy transient suppression. With only 200mW continuous power handling and no specified surge current rating, it will likely fail during automotive load dump (e.g., ISO 7637-2 pulses) or repeated ESD strikes. Its SOD-323 package also lacks the robustness of larger TVS diodes. For automotive or industrial environments, pair it with a dedicated transient suppressor (e.g., SMAJ5.0A or PESD5V0S1BA) upstream. Use the BZT52C3V0S only for steady-state regulation or light clamping after primary transient protection—never as the sole defense against high-energy spikes.
What layout and soldering precautions are critical when assembling the BZT52C3V0S on a high-volume SMT line, and how might moisture sensitivity affect long-term reliability?
Although the BZT52C3V0S has MSL 1 (unlimited floor life), improper reflow profiling can still induce microcracks in the SOD-323 package due to CTE mismatch between silicon and mold compound. Ensure peak reflow temperature stays below 260°C with a controlled ramp rate (<3°C/sec) to minimize thermal stress. Additionally, avoid placing vias directly under the component pad, as solder wicking can create voids and increase thermal resistance. For high-reliability applications (e.g., medical or aerospace), perform cross-section analysis on early production units to verify voiding and joint integrity—especially since SOD-323’s small size makes inspection challenging and increases susceptibility to latent failures under thermal cycling.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
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