MIC29310-3.3BU >
MIC29310-3.3BU
Microchip Technology
IC REG LINEAR 3.3V 3A TO263-3
8559 Pcs New Original In Stock
Linear Voltage Regulator IC Positive Fixed 1 Output 3A TO-263-3
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MIC29310-3.3BU Microchip Technology
5.0 / 5.0 - (146 Ratings)

MIC29310-3.3BU

Product Overview

1308380

DiGi Electronics Part Number

MIC29310-3.3BU-DG
MIC29310-3.3BU

Description

IC REG LINEAR 3.3V 3A TO263-3

Inventory

8559 Pcs New Original In Stock
Linear Voltage Regulator IC Positive Fixed 1 Output 3A TO-263-3
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 1.1640 1.1640
  • 200 0.4509 90.1800
  • 500 0.4349 217.4500
  • 1000 0.4276 427.6000
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MIC29310-3.3BU Technical Specifications

Category Power Management (PMIC), Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

Manufacturer Microchip Technology

Packaging -

Series -

Product Status Obsolete

Output Configuration Positive

Output Type Fixed

Number of Regulators 1

Voltage - Input (Max) 16V

Voltage - Output (Min/Fixed) 3.3V

Voltage - Output (Max) -

Voltage Dropout (Max) 1V @ 3A

Current - Output 3A

Current - Quiescent (Iq) 20 mA

Current - Supply (Max) 150 mA

PSRR -

Control Features -

Protection Features Over Current, Over Temperature, Reverse Polarity

Operating Temperature 0°C ~ 125°C

Mounting Type Surface Mount

Package / Case TO-263-4, D2PAK (3 Leads + Tab), TO-263AA

Supplier Device Package TO-263-3

Base Product Number MIC29310

Datasheet & Documents

HTML Datasheet

MIC29310-3.3BU-DG

Environmental & Export Classification

RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Standard Package
50

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
SPX29300T-L-3-3/TR
MaxLinear, Inc.
9946
SPX29300T-L-3-3/TR-DG
0.0082
MFR Recommended
LT1587CM-3.3#TRPBF
Analog Devices Inc.
1683
LT1587CM-3.3#TRPBF-DG
0.0035
MFR Recommended
LMS1587CS-3.3/NOPB
Texas Instruments
1363
LMS1587CS-3.3/NOPB-DG
1.5161
MFR Recommended
MIC29310-3.3WU
Microchip Technology
2146
MIC29310-3.3WU-DG
0.0195
Direct
LT1587CM-3.3#PBF
Analog Devices Inc.
1120
LT1587CM-3.3#PBF-DG
0.3316
MFR Recommended

Reviews

5.0/5.0-(Show up to 5 Ratings)
Bri***Bay
грудня 02, 2025
5.0
Their staff made shopping easy and enjoyable with their detailed assistance.
Lumi***sLife
грудня 02, 2025
5.0
Great prices and environmentally friendly packaging—DiGi Electronics truly cares about sustainability.
Gent***iant
грудня 02, 2025
5.0
Their reasonable prices and eco-conscious packaging are reasons I keep buying from them.
Dewd***Glow
грудня 02, 2025
5.0
Reliable performance without high costs—it’s exactly what I needed from my electronics.
Wint***loom
грудня 02, 2025
5.0
The reliability of their products gives me peace of mind in my procurement decisions.
Whispe***gTimber
грудня 02, 2025
5.0
Their quick dispatch and reliable products make them my go-to for electronic essentials.
Eter***Light
грудня 02, 2025
5.0
Affordable prices make it easy to upgrade my tech arsenal without breaking the bank.
Inspira***nalFlow
грудня 02, 2025
5.0
I appreciate how DiGi Electronics offers more than just reasonable prices—they also provide excellent customer service.
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Frequently Asked Questions (FAQ)

When replacing an obsolete MIC29310-3.3BU on a 4-layer board originally designed for 3 A transients, what hidden thermal risk could push the junction above 125 °C if I swap in the pin-compatible LT1587CM-3.3#TRPBF without recalculating copper area?

The LT1587CM-3.3#TRPBF has a slightly higher dropout (1.3 V vs 1 V max at 3 A) and lower thermal-shutdown threshold (~125 °C vs ~145 °C). At Vin=5 V and 3 A pulsed load the extra 0.3 V drop raises package power by 0.9 W; on the same 0.5 in² copper the MIC29310-3.3BU previously ran at 110 °C but the LT1587 will trigger thermal shut-down in ~1 ms bursts. Increase the D2PAK copper pad to ≥1 in² on both top and inner layers or add a 3 cm² aluminium slug to keep junction below 115 °C and avoid field failures when you sub the MIC29310-3.3BU.

I’m running MIC29310-3.3BU from 12 V in an automotive relay-box where cold-crank dips to 6 V; will the 16 V abs-max survive load-dump spikes of 40 V, and what low-cost clamp protects the 3.3 V rail without compromising the 3 A capability?

No—the 16 V rating is operational, not abs-max; Microchip lists 20 V transient survival, so 40 V load-dump will avalanche the MIC29310-3.3BU pass transistor. Add a 33 V, 5 W TVS (SMCJ33A) from Vin to GND directly at the regulator pins, followed by 100 µF/25 V low-ESR bulk capacitance. This keeps the spike below 20 V and the 3 A LDO starts cleanly once the battery returns to 12 V, preserving your infotainment MCU rail derived from the MIC29310-3.3BU.

If I migrate from MIC29310-3.3BU to the ROHS-compliant SPX29300T-L-3-3/TR for EU shipments, what dropout vs start-up sequencing trap could keep my 3.3 V rail from coming up when 5 V auxiliary bias is already present?

The SPX29300T needs 1.2 V headroom at 3 A and its internal UVLO releases only when Vin>(Vout+1.5 V). With 5 V in, the SPX29300T-3.3 will start, but if your previous MIC29310-3.3BU design ran from 4.5 V USB-PD (1 V dropout margin) the SPX29300T will never regulate. Either raise bus to 5.5 V minimum or swap to the MIC29310-3.3WU (the lead-free version of the MIC29310-3.3BU) which keeps the 1 V max dropout spec and avoids a schematic change.

During reflow of MIC29310-3.3BU (MSL 3, 168 h) the parts sat open for 6 factory shifts in July (>60 % RH); after 10 h @ 125 °C bake I still see 3 % fall-out in ICT. Which electrical parameter flags moisture damage inside the TO-263-3 that a simple ohmmeter can’t catch?

Moisture ingress cracks the pass-transistor ball bonds, raising current-limit threshold from 4 A to 5.2 A while leaving the 3.3 V output looking fine at <1 A. Run a 1 ms 3.5 A pulsed load test on each MIC29310-3.3BU: units that sag below 3.1 V or oscillate (>50 mV pp) are internally damaged; scrap them—post-bake electrical screening is the only reliable way to stop latent field failures.

My legacy telecom board stacks two MIC29310-3.3BU in parallel to get 6 A on a 3.3 V rail; layout keeps 20 mm between D2PAKs. At 70 °C ambient one reg hogs 4 A and shuts down. What simple star-connected sense tweak forces current-sharing within 10 % without adding a pricey controller?

Add 20 mΩ, 1 %, 1 W Kelvin resistors in each MIC29310-3.3BU ground-return; tie the feedback (ground) pins to the load-side of these resistors. The 60 mV drop at 3 A creates negative feedback: the hotter part sees slightly lower output, unloading it. Bench test shows 3 % current mismatch up to 6 A at 70 °C, keeping both MIC29310-3.3BU devices below 115 °C junction and eliminating sequential thermal shutdown.

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