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ATUC256L3U-Z3UT
Microchip Technology
IC MCU 32BIT 256KB FLASH 64QFN
5452 Pcs New Original In Stock
AVR AVR®32 UC3 L Microcontroller IC 32-Bit Single-Core 50MHz 256KB (256K x 8) FLASH 64-QFN (9x9)
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5.0 / 5.0
- (232 Ratings)
ATUC256L3U-Z3UT
Product Overview
1442195
DiGi Electronics Part Number
ATUC256L3U-Z3UT-DGManufacturer
Microchip Technology
ATUC256L3U-Z3UT
Description
IC MCU 32BIT 256KB FLASH 64QFNInventory
5452 Pcs New Original In Stock
AVR AVR®32 UC3 L Microcontroller IC 32-Bit Single-Core 50MHz 256KB (256K x 8) FLASH 64-QFN (9x9)
Quantity
Minimum 1
Minimum 1
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ATUC256L3U-Z3UT Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
AVR®32 UC3 L
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
AVR
Core Size
32-Bit Single-Core
Speed
50MHz
Connectivity
I2C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
51
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
32K x 8
Voltage - Supply (Vcc/Vdd)
1.62V ~ 3.6V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
64-QFN (9x9)
Package / Case
64-VFQFN Exposed Pad
Base Product Number
ATUC256
Datasheet & Documents
HTML Datasheet
ATUC256L3U-Z3UT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
ATUC256L3UZ3UT
Standard Package
260
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
售後服務快速有效，讓我們在使用上沒有後顧之憂。
грудня 02, 2025
J'apprécie leur engagement envers la qualité, chaque produit répond à mes attentes.
грудня 02, 2025
DiGi Electronics sorgt stets für ausreichend Vorrat, sodass wir nie auf Lieferengpässe stoßen.
грудня 02, 2025
丁寧な対応と良心的な価格に感動しています。長期的にお付き合いしたい企業です。
грудня 02, 2025
Their team handled every question with expertise and courtesy.
грудня 02, 2025
I highly recommend their shop for both cost-effectiveness and reliable shipping.
грудня 02, 2025
The support I received post-purchase reassures me of their dedication to customer care.
грудня 02, 2025
Every interaction with their customer service team was positive and solution-oriented.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing the ATUC256L3U-Z3UT with a lower-power ARM Cortex-M0+ microcontroller in a battery-powered industrial sensor node?
Replacing the ATUC256L3U-Z3UT with an ARM Cortex-M0+ device (e.g., Microchip SAM D21 or STMicroelectronics STM32L072KZ) introduces firmware compatibility risks due to architectural differences—AVR32 uses a MIPS-like instruction set while Cortex-M0+ uses Thumb-2. You’ll need to verify real-time peripheral behavior, especially DMA and USB wake-from-sleep timing, as the ATUC256L3U-Z3UT supports autonomous peripheral operation that may not map directly. Additionally, the 1.62V minimum supply voltage of the ATUC256L3U-Z3UT enables ultra-low-voltage operation; many Cortex-M0+ parts require ≥1.8V, which could force a regulator redesign and increase quiescent current, negating power savings in deep sleep modes.
How does the exposed pad on the ATUC256L3U-Z3UT 64-QFN package affect PCB layout and thermal reliability in high-vibration environments?
The exposed thermal pad on the ATUC256L3U-Z3UT must be soldered to a grounded copper pour with multiple thermal vias to ensure both electrical grounding and mechanical stability. In high-vibration applications (e.g., automotive or industrial machinery), inadequate pad soldering can lead to intermittent failures due to cracked joints. Use a stencil with 50–70% aperture reduction to avoid solder voids, and ensure the PCB has a continuous ground plane beneath the device. Thermal cycling between -40°C and 85°C can induce stress; follow IPC-7093 guidelines for QFN assembly and consider underfill if the board undergoes frequent shock or flexure.
Can the ATUC256L3U-Z3UT safely drive 5V-tolerant I/O pins when powered at 3.3V in a mixed-voltage system without level shifters?
No—the ATUC256L3U-Z3UT I/O pins are not 5V-tolerant when VDD is below 3.6V. Applying 5V signals to any GPIO while the MCU is powered at 3.3V risks damaging the internal ESD diodes and causing latch-up. Even if the datasheet lists absolute maximum ratings up to VDD + 0.3V, exceeding this (e.g., 5V on a 3.3V rail) violates safe operating conditions. For reliable interfacing with 5V logic (e.g., legacy sensors or TTL devices), use bidirectional level translators like the TXB0108 or discrete MOSFET-based circuits. This is a common oversight during drop-in replacements of older 5V MCUs.
What are the trade-offs when using the internal oscillator of the ATUC256L3U-Z3UT versus an external crystal for USB communication in a cost-sensitive consumer device?
The ATUC256L3U-Z3UT’s internal RC oscillator (±1% accuracy over temperature and voltage) may not meet USB Full-Speed timing requirements without periodic recalibration via the USB frame signal. While this saves BOM cost and board space by eliminating a 12MHz crystal, it introduces reliability risks in environments with wide temperature swings or supply noise—common in unregulated consumer products. If your design operates near the -40°C to 85°C extremes or uses a noisy DC-DC converter, an external crystal (e.g., ECS-120-12-30B-CGN) is strongly recommended to avoid USB enumeration failures. Always validate USB compliance with a protocol analyzer under worst-case conditions.
How does the moisture sensitivity level (MSL 3) of the ATUC256L3U-Z3UT impact high-volume manufacturing and rework processes?
The ATUC256L3U-Z3UT’s MSL 3 rating means it can be exposed to ambient conditions for only 168 hours (7 days) after removal from dry packaging before requiring a bake. In high-volume production, this demands strict FIFO handling and humidity-controlled storage (<10% RH). During rework, if the part is desoldered and not immediately replaced, it must be rebaked at 125°C for 24 hours to remove absorbed moisture—failure to do so risks ‘popcorning’ during reflow. Unlike MSL 1 parts (unlimited floor life), this constraint increases logistics complexity and scrap risk, especially in humid regions. Always track exposure time using moisture indicator cards and integrate bake cycles into your rework SOP.
Quality Assurance (QC)
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ATUC256L3U-Z3UT CAD Models
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