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ATTINY261-15MZ
Microchip Technology
IC MCU 8BIT 2KB FLASH 32QFN
46900 Pcs New Original In Stock
AVR AVR® ATtiny Microcontroller IC 8-Bit 16MHz 2KB (1K x 16) FLASH 32-QFN (5x5)
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5.0 / 5.0
- (373 Ratings)
ATTINY261-15MZ
Product Overview
1259474
DiGi Electronics Part Number
ATTINY261-15MZ-DGManufacturer
Microchip Technology
ATTINY261-15MZ
Description
IC MCU 8BIT 2KB FLASH 32QFNInventory
46900 Pcs New Original In Stock
AVR AVR® ATtiny Microcontroller IC 8-Bit 16MHz 2KB (1K x 16) FLASH 32-QFN (5x5)
Quantity
Minimum 1
Minimum 1
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ATTINY261-15MZ Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
AVR® ATtiny
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
USI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
16
Program Memory Size
2KB (1K x 16)
Program Memory Type
FLASH
EEPROM Size
128 x 8
RAM Size
128 x 8
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C (TA)
Grade
Automotive
Qualification
AEC-Q100
Mounting Type
Surface Mount
Supplier Device Package
32-QFN (5x5)
Package / Case
32-VFQFN Exposed Pad
Base Product Number
ATTINY261
Datasheet & Documents
HTML Datasheet
ATTINY261-15MZ-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
1611-ATTINY261-15MZCTINACTIVE
ATTINY261-15MZTR
ATTINY261-15MZ-DG
ATTINY261-15MZCT
1611-ATTINY261-15MZDKR-DG
1611-ATTINY261-15MZTR-DG
1611-ATTINY261-15MZTR
1611-ATTINY261-15MZTRINACTIVE
ATTINY261-15MZDKR
1611-ATTINY261-15MZDKR
1611-ATTINY261-15MZDKRINACTIVE
ATTINY26115MZ
Standard Package
5,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
They handle our queries professionally, making us feel valued.
грудня 02, 2025
I appreciated the detailed product information that was easily accessible and well-presented.
грудня 02, 2025
DiGi Electronics' product variety allows me to source everything from one reliable provider.
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Frequently Asked Questions (FAQ)
Can the ATTINY261-15MZ be used as a drop-in replacement for the ATTINY261A-15MZ in a 12V automotive sensor interface design, and what firmware or hardware changes might be needed?
The ATTINY261-15MZ is not a direct drop-in for the ATTINY261A-15MZ due to subtle but critical differences in power-on reset (POR) thresholds and brown-out detection (BOD) behavior, especially under low-voltage transients common in 12V automotive environments. While both are AEC-Q100 qualified and share the same pinout and package, the non-'A' version may exhibit less predictable startup behavior during voltage dips. To safely replace the ATTINY261A-15MZ, add an external supervisor IC (e.g., TPS3839) to ensure clean resets, and verify that your firmware initializes all peripherals after a cold start. Always validate under ISO 7637-2 pulse testing conditions.
What are the key reliability risks when using the ATTINY261-15MZ in high-vibration automotive applications near the -40°C to 125°C operating range, particularly regarding solder joint integrity and internal oscillator stability?
The ATTINY261-15MZ’s 32-QFN exposed pad package is susceptible to solder joint fatigue under sustained vibration and thermal cycling, especially at temperature extremes. The internal 8MHz oscillator (scaled to 16MHz via PLL) can drift up to ±3% over the full temperature range, which may violate timing margins in USI-based communication. Mitigate this by using SAC305 solder with proper stencil aperture design for the thermal pad, applying conformal coating to reduce mechanical stress, and calibrating the internal oscillator at room temperature with periodic re-synchronization in software. For mission-critical timing, consider an external 16MHz ceramic resonator despite the added BOM cost.
How does the ATTINY261-15MZ compare to the STM8S003F3P6 in terms of real-world power consumption during sleep modes in a battery-powered automotive telematics unit, and which is better for minimizing quiescent current?
In practice, the ATTINY261-15MZ typically draws 0.1µA in power-down mode with WDT disabled, outperforming the STM8S003F3P6’s ~0.5µA typical quiescent current. However, the STM8S003F3P6 has a faster wake-up time from halt mode (~4µs vs ~6µs on the ATTINY261-15MZ), which matters in burst-communication scenarios. For long-term battery life in telematics, the ATTINY261-15MZ is superior—but only if your firmware fully disables unused peripherals and leverages its aggressive sleep modes. Always measure actual current on your PCB, as leakage through external pull-ups or PCB contamination can negate theoretical advantages.
What design precautions are necessary when routing the exposed thermal pad on the 32-QFN package of the ATTINY261-15MZ to avoid solder voids and ensure reliable heat dissipation in a compact engine control module?
To prevent solder voids and ensure thermal reliability with the ATTINY261-15MZ’s 32-QFN exposed pad, use a non-solder-mask-defined (NSMD) pad on the PCB with a 4x4 array of 0.3mm vias under the pad, filled and capped if possible. Apply a laser-cut stencil with 80% aperture reduction and trapezoidal walls to control solder paste volume. During reflow, follow a profile with a 60–90 second soak above 150°C to allow outgassing. Solder voids >30% can increase junction temperature by 15°C under load, risking premature failure—validate with X-ray inspection during prototype builds, especially since the ATTINY261-15MZ lacks an external heatsink option.
Is it safe to operate the ATTINY261-15MZ at 5.5V continuously in an industrial environment with frequent voltage spikes, and how does its ESD protection compare to the newer ATTINY261A-15MZ?
While the ATTINY261-15MZ is rated for 5.5V continuous operation, sustained exposure near this limit—especially with inductive load switching or load-dump transients common in industrial settings—can degrade the internal regulator and I/O protection diodes over time. The ATTINY261-15MZ has basic ESD protection (typically ±2kV HBM), whereas the ATTINY261A-15MZ improves this to ±4kV. For robust operation, add a TVS diode (e.g., SMAJ5.0A) on the VDD line and clamp all I/Os with Schottky diodes to ground and VDD. Do not rely solely on the MCU’s built-in protection; field failures often trace back to cumulative ESD stress below the datasheet threshold.
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ATTINY261-15MZ CAD Models
Microchip Technology ATTINY261-15MZ PCB symbols & footprints
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