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93LC66BT-I/MS
Microchip Technology
IC EEPROM 4KBIT MICROWIRE 8MSOP
5260 Pcs New Original In Stock
EEPROM Memory IC 4Kbit Microwire 2 MHz 8-MSOP
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5.0 / 5.0
- (94 Ratings)
93LC66BT-I/MS
Product Overview
1409293
DiGi Electronics Part Number
93LC66BT-I/MS-DGManufacturer
Microchip Technology
93LC66BT-I/MS
Description
IC EEPROM 4KBIT MICROWIRE 8MSOPInventory
5260 Pcs New Original In Stock
EEPROM Memory IC 4Kbit Microwire 2 MHz 8-MSOP
Quantity
Minimum 1
Minimum 1
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365 - Day Quality Guarantee - Every part fully backed.
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93LC66BT-I/MS Technical Specifications
Category
Memory, Memory
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
DiGi-Electronics Programmable
Verified
Memory Type
Non-Volatile
Memory Format
EEPROM
Technology
EEPROM
Memory Size
4Kbit
Memory Organization
256 x 16
Memory Interface
Microwire
Clock Frequency
2 MHz
Write Cycle Time - Word, Page
6ms
Voltage - Supply
2.5V ~ 5.5V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package
8-MSOP
Base Product Number
93LC66
Datasheet & Documents
HTML Datasheet
93LC66BT-I/MS-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.32.0051
Additional Information
Other Names
93LC66BT-I/MS-NDR
Standard Package
2,500
Alternative Parts
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Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
いつも期待以上の品質とスピーディーな配送に満足しています。
грудня 02, 2025
Their packaging safeguards my items, and the tracking system keeps me confident about delivery times.
грудня 02, 2025
Fast dispatch and shipping made the entire experience extremely satisfying.
грудня 02, 2025
The secure packaging practices reflect a customer-centric approach.
грудня 02, 2025
I always receive my orders on time, thanks to their reliable logistics.
грудня 02, 2025
I've been impressed by how durable their items are; they hold up perfectly through continuous use.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the 93LC66BT-I/MS in a noisy automotive environment with variable power supply?
When integrating the 93LC66BT-I/MS in electrically noisy environments like automotive systems, the primary risks include potential corruption during write cycles due to voltage dips or EMI on the Microwire interface. Since the 93LC66BT-I/MS has a 6ms word write cycle and requires a stable 2.5V–5.5V supply, use local decoupling (e.g., 100nF ceramic capacitor close to VCC) and consider upstream voltage supervision (e.g., a reset IC like MCP130) to prevent partial writes during brown-out conditions. Shielding or filtering on CLK and DI lines may also be needed in high-noise applications to maintain Microwire signal integrity.
Can the 93LC66BT-I/MS replace the BR93L66RFVM-WTR in an existing design, and what interface compatibility issues should I watch for?
Yes, the 93LC66BT-I/MS can generally replace the BR93L66RFVM-WTR as both are 4Kbit Microwire EEPROMs with compatible 256 x 16 organization and similar voltage ranges. However, verify instruction set alignment—while most Microwire EEPROMs use standard opcodes (e.g., 0x1 for WRITE, 0x2 for READ), timing differences may exist. The 93LC66BT-I/MS has a maximum 2 MHz clock rate and 6ms write cycle; ensure firmware allows adequate timing margins. Also confirm that the BR93L66RFVM-WTR doesn’t use manufacturer-specific features (e.g., password protection) absent in the 93LC66BT-I/MS.
How does the 6ms write cycle time of the 93LC66BT-I/MS impact real-time system reliability, and what design strategies minimize data loss?
The 6ms write cycle in the 93LC66BT-I/MS means the device is busy and cannot accept new commands during this time—this can block firmware execution if polling isn’t handled properly. To improve system reliability, implement non-blocking write routines with timeout monitoring, or use a hardware busy-detection circuit via the DO pin. Avoid writing during critical timing windows; instead, buffer data in volatile memory and write in batches. Frequent writes should be minimized to reduce wear—EEPROM typically supports ~1 million cycles, so apply wear leveling logic if updates exceed 100K cycles.
What are the thermal and mechanical considerations when designing the 93LC66BT-I/MS into a densely packed high-density PCB?
The 8-MSOP package of the 93LC66BT-I/MS has limited thermal dissipation; while power consumption is low (typ. 3mA active), adjacent heat sources (e.g., DC-DC converters) can push junction temperature beyond the rated 85°C operating limit. Ensure at least 0.5mm clearance to high-power components and avoid shared thermal vias. Use proper PCB land patterns per IPC-7351 to prevent tombstoning during reflow—MSL 1 simplifies floor life management, but still adhere to recommended reflow profiles to avoid micro-cracking.
How do I ensure long-term availability and design robustness when selecting the 93LC66BT-I/MS over similar parts like the 93LC66B-I/MS?
The 93LC66BT-I/MS and 93LC66B-I/MS are functionally equivalent, but the 'T' suffix typically indicates tape and reel packaging for automated assembly—confirm with Microchip’s ordering guide that the underlying die is identical. To ensure long-term design robustness, check Microchip’s product longevity program (they usually guarantee 10+ years for active parts). Also, define acceptable parameter overlap: verify that both parts share the same 2.5V–5.5V range, 2 MHz clock tolerance, and -40°C to 85°C operation. Include at least one second-source option in BOM notes, such as BR93L66RFVM-WTR, with compatibility caveats documented.
Quality Assurance (QC)
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93LC66BT-I/MS CAD Models
Microchip Technology 93LC66BT-I/MS PCB symbols & footprints
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