CY8C20446A-24LQXI >
CY8C20446A-24LQXI
Infineon Technologies
MCU 16K FLASH 2K SRAM 32QFN
4300 Pcs New Original In Stock
Embedded, Integrated Circuits (ICs)
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CY8C20446A-24LQXI Infineon Technologies
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CY8C20446A-24LQXI

Product Overview

6330321

DiGi Electronics Part Number

CY8C20446A-24LQXI-DG
CY8C20446A-24LQXI

Description

MCU 16K FLASH 2K SRAM 32QFN

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4300 Pcs New Original In Stock
Embedded, Integrated Circuits (ICs)
Quantity
Minimum 1

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  • 200 0.1205 24.1000
  • 500 0.1163 58.1500
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CY8C20446A-24LQXI Technical Specifications

Category Embedded, Application Specific Microcontrollers

Manufacturer Infineon Technologies

Packaging Tray

Series CapSense® Controllers

Product Status Active

DiGi-Electronics Programmable Not Verified

Applications Capacitive Sensing

Core Processor M8C

Program Memory Type FLASH (16kB)

Controller Series CY8C20xx6A

RAM Size 2K x 8

Interface I2C, SPI

Number of I/O 28

Voltage - Supply 1.71V ~ 5.5V

Operating Temperature -40°C ~ 85°C

Mounting Type Surface Mount

Package / Case 32-UFQFN Exposed Pad

Supplier Device Package 32-QFN (5x5)

Base Product Number CY8C20446

Datasheet & Documents

HTML Datasheet

CY8C20446A-24LQXI-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Additional Information

Other Names
2156-CY8C20446A-24LQXI
CY8C20446A24LQXI
2832-CY8C20446A-24LQXI
2015-CY8C20446A-24LQXI
-CY8C20446A-24LQXI
SP005648479
CYPCYPCY8C20446A-24LQXI
Standard Package
2,450

Understanding the CY8C20446A-24LQXI: A Focused Guide for Haptic-Enabled Touch Sensing Applications

Product overview: CY8C20446A-24LQXI microcontroller series

The CY8C20446A-24LQXI microcontroller serves as a key component within Infineon's PSoC family, recognized for its integration of programmable logic, mixed-signal capabilities, and embedded microcontroller performance. Engineered in a 32-QFN package, it balances physical compactness with significant silicon resource density, targeting applications constrained by PCB space and cost per unit constraints.

At its core, the device incorporates a 16 KB Flash array and 2 KB of SRAM, enabling the deployment of moderately complex embedded firmware with efficient handling of real-time tasks. The Flash supports in-system programmability—critical for rapid prototyping cycles and field updates in production environments, thereby streamlining firmware iteration. The internal architecture leverages the PSoC’s configurable analog and digital blocks, allowing designers to tailor peripheral sets precisely to system requirements, such as replacing external components for oscillator, timer, or filtering functions, ultimately reducing BOM and manufacturing complexity.

The CY8C20446A-24LQXI notably embeds CapSense® touch sensing technology, which provides high-resolution capacitive touch input with proven noise immunity due to the shielded sensor design and advanced signal processing algorithms. Both single-touch button arrays and complex slider or proximity sensors are supported, delivering reliable and consistent user interaction across diverse environmental conditions. Furthermore, the microcontroller’s CapSense engine enables seamless integration with haptic feedback control, synchronizing tactile actuation with touch detection in real time. This synergy addresses the challenge of creating intuitive, responsive user interfaces in white goods, automotive cabin controls, and portable electronics, where tactile feedback is increasingly vital for accessibility and user satisfaction.

From a system engineer’s viewpoint, the platform’s programmable analog front end significantly accelerates signal conditioning, offering on-chip comparators, op-amps, and multiplexed routing. This flexibility not only shortens development cycles but also elevates noise performance and power efficiency—observable in tightly regulated sensing applications and wearable devices operating under battery constraints. One practical advantage surfaces during iterative design: rapid peripheral reconfiguration is achievable via software updates rather than PCB respins, fostering agile validation of new interface layouts or sensor combinations.

In terms of best practices, efficient utilization of CapSense channels in a multiplexed topology allows the implementation of large button matrices with minimal pin overhead. Employing the PSoC Creator IDE’s auto-tuning tools further streamlines sensor calibration, mitigating process drift and material variability. The inclusion of haptic feedback circuitry often necessitates careful management of power domains and output driver strength, which can be dynamically adjusted within the device firmware, ensuring robust actuation while maintaining electromagnetic compatibility.

Overall, the CY8C20446A-24LQXI demonstrates an architectural philosophy based on integration, configurability, and scalability. It stands out where touch and haptic interface requirements intersect with demands for cost optimization, board miniaturization, and rapid product iterations. Such capability positions the device as a preferred candidate in next-generation user interface modules, bringing design versatility while minimizing both risk and time to market.

Key features and application highlights of CY8C20446A-24LQXI

The CY8C20446A-24LQXI microcontroller offers a specialized integration path for tactile feedback, addressing a critical gap in capacitive touch solutions by incorporating support for haptics through the Immersion TouchSense 2000 Haptics Effect Library. At the silicon level, a mixed-signal core optimized for 3.3 V operation streamlines power domain compatibility, making the device suitable for a wide range of low-voltage applications where energy efficiency and electrical noise immunity are paramount. The device's flexible pin-count and peripheral multiplexing further reduce PCB layers and BOM cost, directly targeting high-density layouts typical in advanced consumer electronics.

At the firmware and application layer, the microcontroller's design provides deep configurability via selectable hardware and software timing paths. This architecture allows precise synchronization of haptic effects in response to capacitive touch events, minimizing latency penalties and jitter. The support for up to 14 pre-designed haptic effects, each with parametric control, enables nuanced tactile feedback profiles that can be fine-tuned during field validation, reducing the need for iterative hardware revisions. The out-of-the-box compatibility with common actuator models (such as Sanyo NRS-2574i and Jinlong Z6DL2A017000B) addresses the real-world constraints imposed by form factor and supply chain variation, significantly accelerating the validation and pilot production timeline.

Integration with CapSense® buttons exemplifies a system-level approach—here, the tactile layer is not merely an add-on but an intrinsic extension of the user interface. This synergy enables designers to replace physical buttons with solid-state alternatives without sacrificing the intuitive feedback essential for high-stakes or safety-critical applications, notably in automotive HMIs or whitegoods control panels. In practice, this re-architecting streamlines mechanical design by consolidating UI, illumination, and feedback into a single surface, supporting greater ingress protection and reducing assembly complexity.

Experience indicates that optimal haptic effect selection hinges on the interplay between actuation amplitude, duration, and waveform shape—parameters best validated through user-centric field trials rather than laboratory-only testing. Tighter control loops between CapSense detection and haptic generation, realized via the robust firmware API, enable deterministic tactile responses with low code overhead, simplifying path-to-production while supporting post-deployment reconfiguration if product requirements shift.

A key insight is the transformative potential of engineer-driven, firmware-based iteration, which sets the CY8C20446A-24LQXI apart from legacy mechanical UI transitions. By embedding tactile feedback logic at the microcontroller level, it becomes possible to service a broader spectrum of touch interaction patterns and emerging application requirements without frequent hardware redesigns. Ultimately, this convergence of haptics, capacitive sensing, and firmware customizability defines a future-proof pathway for both new product introductions and smart retrofitting initiatives.

Haptics implementation with CY8C20446A-24LQXI and TS2000 User Module

Haptics integration leveraging CY8C20446A-24LQXI and the TS2000 User Module exemplifies a layered engineering approach for tactile feedback systems. At the foundational physical tier, the choice of actuator—typically an eccentric rotating mass (ERM) such as Sanyo or Jinlong models—determines not only the fundamental vibration characteristics but also directly impacts integration considerations. Factors such as the actuator mass, resonant frequency, and mounting orientation must be carefully matched to device enclosures and user touchpoints to ensure desired tactile amplitude and frequency response. In practice, selecting an actuator with an adequate balance between mass and responsiveness is critical to avoid sluggish feedback or mechanical overstress during rapid signal transitions.

The electrical tier mediates between digital intent and physical motion. A drive amplifier, such as the TPA6205A, accepts pulse-width modulated (PWM) signals from the CY8C20446A-24LQXI microcontroller at 3.3V logic, providing the necessary current and voltage swing to actuate the ERM efficiently. Here, design trade-offs revolve around drive strength, supply decoupling for low EMI, and thermal management, especially for compact assemblies. PWM frequency selection is sensitive: lower frequencies can induce audible noise and ineffective vibration, while higher frequencies may exceed actuator mechanical limits or introduce signal distortion. Proper assignment and layout of enable and PWM pins are crucial to minimize trace capacitance and avoid inadvertent crosstalk with sensitive analog domains.

Within the firmware layer, abstraction via the TS2000 User Module empowers application engineers to invoke complex haptic patterns without direct manipulation of timing-critical low-level signals. High-level APIs encapsulate effect sequencing, repeat rates, and energy envelopes, significantly accelerating development cycles and reducing the possibility of drive train misconfiguration. The TS2000's configuration interface supports streamlined assignment of physical pins and amplifier control, simultaneously reducing firmware footprint and tightening integration with system-level event logic.

Real-world deployment has highlighted several practical considerations. Quick effect iteration, possible through reconfiguration of effect libraries and actuator mapping within the TS2000 user module, supports rapid adaptation to evolving UI requirements. Precise timing in PWM signal generation and enable line toggling can be leveraged to produce nuanced tactile responses, such as graded pulses or directional cues, enhancing end-user perception. Additionally, robust signal routing, attention to actuator inrush current, and managed power-up sequencing contribute to both reliability and user experience fidelity.

A core insight emerges from the system's partitioned structure: by decoupling actuator mechanics from PWM signal generation and effect design, the platform fosters modular enhancements. Engineers gain flexibility to upgrade actuators or experiment with new vibration profiles with minimal risk to signal integrity or application logic. The embedded toolchain further enables tight feedback between firmware definition and practical actuation, establishing an iterative loop that drives tactile innovation in dense embedded systems.

Device configuration and resource management for CY8C20446A-24LQXI

Device configuration and resource allocation on the CY8C20446A-24LQXI is inherently a multi-layered optimization task. The TS2000 User Module exposes granular controls tailored to the device’s architecture, supporting both one-block and two-block timer allocations for managing PWM generation and precision periodic events. In a two-block configuration, the assignment leverages dedicated digital hardware for timing, sharply minimizing firmware intervention. This eliminates almost all CPU overhead related to PWM maintenance and interval timing, ensuring deterministic latency for time-critical outputs such as haptic drive signals. The tradeoff, however, is the reservation of a larger portion of the device’s limited universal digital blocks, which can constrain parallel subsystem expansion or the integration of additional signal processing modules.

The one-block configuration strategically routes timer functionality through firmware, using a hybrid approach where control logic supplements hardware to maintain timing. This sparing use of digital blocks results in higher CPU involvement, particularly under high-frequency update conditions or prolonged operation. Nevertheless, resource conservation at the hardware level can be decisive in systems where multifunctionality or scalability must coexist with real-time control loops. A practical design pattern observed in signal multiplexing scenarios utilizes this mode to sequentially manage multiple sparse outputs, reducing digital block competition without substantial degradation in overall timing accuracy.

Integration flexibility within the TS2000 module is further enhanced by selectable polled or direct-update methods. The polled mode operates with software-driven checks at defined intervals, suitable for scenarios prioritizing low interrupt footprint and allowing a managed degradation in timing precision when strict deadlines are nonessential. Conversely, the direct-update approach executes immediate register writes for critical events, supporting applications with rigorous jitter tolerance or synchronous actuator demands. Systems incorporating event chaining or cross-module signaling tend to benefit from polled strategies during prototyping, shifting to direct-update as timing bottlenecks and interrupt latencies are profiled and optimized.

Configuring robust PWM frequencies above 22 kHz imposes disciplined clock source selection and divider calibration. The embedded PSoC Designer wizard facilitates these tasks, mapping available oscillator sources and inspiring confidence in digital routing integrity. It is common practice to begin with a conservative base clock, scaling divider values iteratively while benchmarking actual output against theoretical targets. Maintaining haptic timing errors below 10% is achievable by pre-characterizing system propagation delays and cross-checking simulated pulse widths with scope measurements during hardware-in-the-loop validation.

Layered resource balancing thus emerges as a critical design methodology. Early architectural decisions, such as digital block allocation and timer sourcing, propagate downstream and influence software complexity, interrupt structure, and the achievable real-time performance envelope. An understated yet defining insight is that subtle shifts in hardware configuration can yield compound effects on task scheduling density and functional extensibility. Trade studies conducted under resource constrained operating profiles consistently indicate that optimal configurations blend hardware and firmware workload, deliberately reserving headroom for system expansion and unanticipated functional overlays.

Angles of practical implementation often revolve around iterative prototyping, real-world signal capture, and adaptive refinement. In multi-functional platforms, configuring TS2000 modes that permit dynamic switching between one-block and two-block approaches offers a mechanism to tune performance in situ, responding to live telemetry on resource bottlenecks and timing drift. This approach, substantiated by empirical profiling, commonly reveals nontrivial savings in design cycle time and debugging effort, as hardware limitations are mapped earlier and allowed to inform firmware modularity and event handling policy. The unique interface between configuration wizard automation and manual calibration thus underpins a resource-aware design strategy, by which CY8C20446A-24LQXI can attain its full operational capability in complex embedded environments.

Peripheral interfacing and external component guidance for CY8C20446A-24LQXI

Effective peripheral interfacing with the CY8C20446A-24LQXI requires precise synchronization between MCU features and the physical demands of connected components. The device’s GPIOs must be mapped with awareness of both digital bandwidth and analog signal constraints, especially when supporting haptic actuators. Selecting actuators such as the Sanyo NRS-2574i for sub-150g payloads leverages its low current consumption and rapid response profile, while the Jinlong Z6DL2A017000B, rated for heavier loads, provides the necessary force coefficient and maintains low back-EMF under dynamic conditions. Consistent actuation relies on pairing these devices with drive amplifiers—Texas Instruments’ TPA6205A, for instance—operating strictly at 3.3V to match the CY8C20446A-24LQXI’s logic thresholds and prevent signal level mismatch, which could degrade performance or trigger overcurrent protection.

Each peripheral’s pin assignment needs to be validated at the schematic stage. Actuator PWM and enable signals should be routed through pins uninvolved in high priority serial buses like I2C or SPI. Reserving these lines prevents timing conflicts and bus contention. Cross-referencing the device datasheet with a netlist helps preempt crosstalk and voltage domain overlap, especially for designs integrating capacitive touch, analog sensing, or I2C EEPROMs on shared PCB layers.

The actual performance of the haptic interface depends not only on part selection but on board-level layout. Signal traces for actuator controls should be kept short and matched in impedance to minimize propagation delay and distortion. Decoupling capacitors proximate to both the MCU Vdd input and amplifier supply rails act to suppress transient dips caused by startup surge in capacitive actuators. The PWM frequency—chosen in the range where actuator resonance is negligible—must be generated using hardware timers in the MCU, exploiting their low-jitter output rather than software toggling. Trace isolation from noisy power rails further reduces susceptibility to EMI, which, if unaccounted for, can inadvertently modulate actuator response or trigger spurious resets.

A structured design review, focusing on signal integrity simulations and empirical measurement of actuator dynamics, enhances both reliability and tactile consistency. Small modifications, such as adjusting the drive strength setting in the MCU’s port configuration, can significantly sharpen edge transitions, leading to more precise actuator movement. Additionally, redundant grounding in sensitive regions and opto-isolation for high-current paths further buffer the system against unpredictable field conditions. In applications where field programmability is required, leaving test points for each actuator line simplifies in-situ diagnostics, ensuring maintenance efficiency in large-scale deployments.

Integrating lessons learned from benchmarking different actuator and amplifier combinations under varying load conditions demonstrates that no universal configuration suffices—empirical tuning remains essential. Thus, a methodical approach to external component selection, schematic diligence, and board-level optimization collectively establish a resilient, finely controllable haptic interface built upon the CY8C20446A-24LQXI platform.

Firmware development: APIs and example integration for CY8C20446A-24LQXI

The TS2000 User Module abstracts haptic effect control for the CY8C20446A-24LQXI platform, offering firmware engineers a lean and reliable interface through dedicated APIs. The initialization sequence, TS2000_Start(), allocates necessary resources and configures the module's operational state, forming a predictable baseline for deterministic startup behavior. Once initialized, firmware can invoke haptic events through TS2000_PlayEffect(), encapsulating the effect trigger process, while TS2000_bPlayEffect() enhances this flow by providing immediate status feedback, enabling tight coupling with state machines or conditional logic for effect synchronization.

Underlying these interfaces is a mechanism designed to handle both polling and interrupt-driven operating paradigms. TS2000_bUpdate() facilitates temporal management in systems utilizing polled loops, where consistent invocation in 5 ms intervals guarantees real-time update processing for haptic output without loss of fidelity. This approach aligns with the module’s non-blocking philosophy; neither haptic triggers nor effect completions impede the main application thread, allowing concurrent sensor processing and responsive user interface routines.

Integration with CapSense elements is typical—upon capacitive sensor actuation, the firmware routes the detected event through TS2000_PlayEffect(), linking tactile feedback directly with user input. Practical deployment highlights the importance of precise effect selection and timing: matching haptic responses to user expectations requires both careful effect parameterization and disciplined invocation. In high-frequency input contexts, the bPlayEffect status return can gate successive triggers, preserving effect clarity and avoiding resource contention. Systems employing interrupts benefit from the module’s swift execution path, allowing the firmware to maintain throughput and avoid latency accumulation.

Experience suggests preemptive resource analysis and dedicated update loop abstraction are foundational for scalable designs. Accepting haptic control as a stateful, asynchronous process—rather than a sequential subroutine—streamlines integration and future expansion. One notable insight is the value of bUpdate’s polling interval as a design variable; adjusting this window can optimize balance between responsiveness and CPU load, especially in multi-effect scenarios or when paired with complex UI logic. Careful synchronization among CapSense handlers, haptic triggers, and update cycles ensures seamless tactile feedback and robust application performance.

Potential equivalent/replacement models for CY8C20446A-24LQXI

When evaluating alternatives for the CY8C20446A-24LQXI, rigorous alignment with both system-level requirements and peripheral integration is key. This device distinguishes itself through a well-integrated CapSense module, versatile digital/analog functionality, and seamless support for haptic feedback. Substitution, therefore, extends beyond a superficial datasheet match and hinges on architectural compatibility, particularly within the broader Infineon and legacy Cypress PSoC landscape.

A granular examination of the CY8C22x45H and CY8C20xx6H product lines reveals significant architectural overlap, making them viable candidates. These devices share TS2000 User Module support, preserving the software investment and easing pin migration. However, parity at the silicon level is not always absolute. Memory architecture—especially available RAM and Flash—tends to diverge between part numbers, necessitating careful profile comparison to avoid runtime limitations in memory-intensive CapSense or haptic routines. The analog front-end and programmable digital blocks also merit close scrutiny, as differences in multiplexing, ADC resolution, or counter/timer availability can restrict implementation flexibility for complex signal paths or custom waveform generation.

In deployments demanding expanded resources or modernized feature sets, migration to the CY8C20x66 or the PSoC 4 portfolio warrants consideration. The PSoC 4 series, in particular, leverages a more advanced analog subsystem and scalable processing power, well-suited for touch applications with high channel counts or multi-mode haptic drive requirements. Careful validation of CapSense generation compatibility, haptic firmware library availability, and cross-core toolchain support is critical during the transition. Experience demonstrates that mechanical and electrical pinout differences, though often apparent in documentation, can introduce subtle PCB routing constraints—necessitating early prototyping and layout iteration to ensure signal integrity and maintain EMI performance, especially in densely packed user interfaces or harsh electrical environments.

Application context further guides optimal selection. Incremental replacements within existing product lines benefit most from devices guaranteeing pin-for-pin and software compatibility, allowing for rapid deployment with minimal recertification effort. Conversely, new product development or major platform overhauls make it feasible to leverage the enhanced configurability and tool ecosystem of newer PSoC series, trading legacy user module familiarity for a broader range of analog and touch features, increased signal-to-noise ratio, and improved power budgeting. Direct comparison of CapSense tuning methodologies between legacy TS2000-based and modern CapSense Component-enabled platforms often uncovers subtle distinctions in touch response, noise resilience, and calibration overhead—regions where practical benchmarking provides decisive clarity.

In summary, systematic evaluation—anchored by detailed functional mapping, iterative prototyping, and nuanced application analysis—forms the bedrock of selecting an optimal alternative for the CY8C20446A-24LQXI. Close coordination between hardware resources, firmware investment, and physical interface constraints ultimately yields the most reliable and future-proof design trajectory.

Conclusion

The CY8C20446A-24LQXI from Infineon Technologies represents a refined convergence of capacitive touch sensing and programmable tactile feedback, engineered for high reliability in compact HMI (human-machine interface) scenarios. The core architecture merges precise analog front-end circuitry with flexible microcontroller resources, which enables the implementation of multi-channel touch detection combined with custom haptic response profiles. This integrated approach minimizes latency and preserves noise immunity even in electrically congested environments, ensuring consistent interface performance across industrial and consumer electronics domains.

A modular design philosophy governs the configuration of the CY8C20446A-24LQXI. Leveraging the TS2000 User Module, designers can abstract low-level register management and concentrate on tuning sensitivity curves, debounce intervals, and actuator response behaviors. This abstraction accelerates iteration cycles during initial prototyping while facilitating rapid adaptation to evolving end-user requirements or shifts in enclosure materials. Such decoupling between hardware parameters and firmware logic promotes manufacturability and simplifies qualification steps, particularly where cross-platform migration or portfolio extension is anticipated.

Robustness in touch interface implementation is amplified by the chip’s handling of environmental variability—humidity, temperature fluctuations, and external EMI. Dynamic auto-calibration algorithms and adaptive thresholding techniques mitigate false activations and enable stable performance in constrained form-factors, such as wearables or IoT devices. Reliability metrics observed through extensive field deployments underscore the value of incorporating software-based filtering and self-test routines, preserving functionality in mission-critical installations without sacrificing responsiveness.

In practical applications, astute utilization of configuration guidelines—such as careful pin mapping, shielded layout strategies, and calibration through the TS2000 module—streamlines mass production and reduces post-market support tickets. Devices leveraging this platform maintain a competitive edge through their ability to offer nuanced haptic cues (e.g., pressure modulation, multipoint feedback) while optimizing BOM costs and PCB real estate. Seamless integration with standard communication protocols further accelerates time-to-market for differentiated interface solutions.

As the landscape for touch-enabled HMIs grows more sophisticated, platform flexibility and forward compatibility emerge as decisive factors. The CY8C20446A-24LQXI’s architecture illustrates a subtle balancing act: maintaining high signal fidelity and user experience under cost and process constraints, while supporting incremental hardware upgrades or vendor interchangeability. In complex system designs, this capacity for graceful scale-up or second-sourcing is increasingly leveraged to future-proof product lines and mitigate supply chain disruptions. The interplay of configurable touch parameters, robust tactile feedback, and scalable design assets positions this device as a strategic tool for engineering teams targeting next-generation interactive systems.

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Catalog

1. Product overview: CY8C20446A-24LQXI microcontroller series2. Key features and application highlights of CY8C20446A-24LQXI3. Haptics implementation with CY8C20446A-24LQXI and TS2000 User Module4. Device configuration and resource management for CY8C20446A-24LQXI5. Peripheral interfacing and external component guidance for CY8C20446A-24LQXI6. Firmware development: APIs and example integration for CY8C20446A-24LQXI7. Potential equivalent/replacement models for CY8C20446A-24LQXI8. Conclusion

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Frequently Asked Questions (FAQ)

What are the key features of the Infineon CY8C20446A microcontroller?

The CY8C20446A features 16KB of Flash memory, 2KB SRAM, 28 I/O ports, and supports capacitive sensing applications with a M8C core processor, making it suitable for embedded system designs.

Is the CY8C20446A microcontroller compatible with I2C and SPI interfaces?

Yes, this microcontroller supports both I2C and SPI interfaces, allowing easy integration with various sensors and peripherals in embedded applications.

What are the typical applications for the CY8C20446A microcontroller?

It is primarily designed for capacitive sensing projects, such as touch buttons and sliders, but can also be used in other embedded device applications requiring low power and high performance.

What are the operating voltage and temperature range for this microcontroller?

The CY8C20446A operates within a voltage range of 1.71V to 5.5V and can withstand temperatures from -40°C to 85°C, suitable for diverse environmental conditions.

How does the packaging and mounting type of the CY8C20446A affect its installation?

This microcontroller comes in a 32-UFQFN surface-mount package, which is ideal for compact, high-density PCB designs and can be soldered directly onto the board for reliable connection.

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