CY7B9950AXI >
CY7B9950AXI
Infineon Technologies
IC CLK BUFF 32TQFP
1183 Pcs New Original In Stock
Clock Buffer, Fanout Distribution IC 200MHz 1 32-TQFP
Request Quote (Ships tomorrow)
*Quantity
Minimum 1
CY7B9950AXI Infineon Technologies
5.0 / 5.0 - (197 Ratings)

CY7B9950AXI

Product Overview

6325548

DiGi Electronics Part Number

CY7B9950AXI-DG
CY7B9950AXI

Description

IC CLK BUFF 32TQFP

Inventory

1183 Pcs New Original In Stock
Clock Buffer, Fanout Distribution IC 200MHz 1 32-TQFP
Quantity
Minimum 1

Purchase and inquiry

Quality Assurance

365 - Day Quality Guarantee - Every part fully backed.

90 - Day Refund or Exchange - Defective parts? No hassle.

Limited Stock, Order Now - Get reliable parts without worry.

Global Shipping & Secure Packaging

Worldwide Delivery in 3-5 Business Days

100% ESD Anti-Static Packaging

Real-Time Tracking for Every Order

Secure & Flexible Payment

Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more

All payments encrypted for security

In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 2.0722 2.0722
  • 200 0.8021 160.4200
  • 500 0.7740 387.0000
  • 1000 0.7607 760.7000
Better Price by Online RFQ.
Request Quote (Ships tomorrow)
* Quantity
Minimum 1
(*) is mandatory
We'll get back to you within 24 hours

CY7B9950AXI Technical Specifications

Category Clock/Timing, Clock Generators, PLLs, Frequency Synthesizers

Manufacturer Infineon Technologies

Packaging -

Series -

Product Status Obsolete

DiGi-Electronics Programmable Not Verified

Type Clock Buffer, Fanout Distribution

PLL Yes

Input LVCMOS, LVTTL

Output LVTTL

Number of Circuits 1

Ratio - Input:Output 1:8

Differential - Input:Output No/No

Frequency - Max 200MHz

Divider/Multiplier Yes/Yes

Voltage - Supply 2.375V ~ 3.63V

Operating Temperature -40°C ~ 85°C

Mounting Type Surface Mount

Package / Case 32-TQFP

Supplier Device Package 32-TQFP (7x7)

Base Product Number CY7B9950

Datasheet & Documents

HTML Datasheet

CY7B9950AXI-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
CYPCYPCY7B9950AXI
2832-CY7B9950AXI
Q11596280
2015-CY7B9950AXI
2156-CY7B9950AXI
Standard Package
250

A Comprehensive Guide to Infineon Technologies CY7B9950AXI: High-Speed, Multi-Phase PLL Clock Buffer for Advanced Clock Distribution

Product Overview: CY7B9950AXI Multi-Phase PLL Clock Buffer

The CY7B9950AXI Multi-Phase PLL Clock Buffer exemplifies advanced clock management tailored for high-performance digital systems. At its foundation, the device integrates a sophisticated phase-locked loop (PLL) architecture with the capability to generate and buffer multiple, precisely phased clock signals. This multi-phase structure directly addresses core challenges in synchronous system design—namely, minimizing clock skew, managing jitter, and maintaining tight timing margins across distributed circuit domains.

Functionality centers around eight independently programmable clock outputs. Each output can be configured for specific phase alignments, a property leveraged in applications such as memory interfaces, multi-processor coordination, and high-speed data transmission lines. This flexibility permits fine-tuning of timing relationships, which is crucial in designs where parallel buses or distributed logic blocks demand synchronized operation at elevated frequencies.

The device architecture prioritizes signal integrity and low latency, achieved through careful drive strength control and output impedance matching. Its optimized output stages permit stable transition edges up to 200 MHz, reducing reflections and crosstalk even in densely routed PCB environments. Drawing from practical deployment in communication network hardware, board layouts benefit from the compact 32-pin TQFP package, which eases placement in constrained systems without compromising thermal performance. The industrial temperature range support (–40 °C to +85 °C) further extends this buffer’s applicability to mission-critical or outdoor deployments where reliability across temperature extremes is mandatory.

From a design perspective, the low-voltage operation aligns with contemporary IO standards, reducing power consumption and improving compatibility with modern chipsets. Engineers gain additional architectural flexibility by programming output phases tailored to dynamic or adaptive clocking schemes, especially in scalable or modular hardware platforms. Field experiences show that such dynamic phase control enables real-time compensation for PCB trace mismatches or layout-induced skews, streamlining board bring-up and long-term maintenance.

A notable aspect lies in the PLL’s robust noise rejection. The design shields output clocks from power-supply fluctuations and external EMI, a feature that proves invaluable when co-locating with analog circuits or in hostile electrical environments. Advanced system designs leverage this intrinsic immunity to achieve higher overall timing accuracy, supporting stringent system-level specifications for synchronous data capture and launch.

In integrating the CY7B9950AXI, typical applications extend beyond basic clock distribution, encompassing multi-clock domain synchronization, fine-grained timing closure in large FPGAs, and deterministic latency management in telecommunication backplanes. These application scenarios consistently reveal increased design margin and reduced debugging cycles, attributable to the device’s reliable phase coherence and customizable output characteristics.

A broader perspective underscores the importance of cohesive clock distribution strategies as digital systems continue to scale in complexity and frequency. The CY7B9950AXI presents an effective building block, not only mitigating technical barriers like jitter and skew but also enhancing system modularity, configurability, and future-proofing in evolving performance ecosystems.

Functional Highlights: Core Features and Technologies of CY7B9950AXI

Functional integration of the CY7B9950AXI centers on its capability to bridge multiple voltage domains through independent 2.5 V and 3.3 V rails and split output bank supplies. This dual-rail topology enables adaptive interfacing, accommodating divergent logic families without external level shifters. In mixed-voltage system architectures—such as bridging legacy LVTTL peripherals with 2.5 V ASIC cores—the device reduces board complexity and isolates sensitive domains, mitigating cross-talk and easing timing closure. Internal output structure ensures LVTTL compatibility with direct drive capability for 50 Ω terminated traces, promoting consistent impedance matching and reliable signal transmission across backplanes or high-speed communication interfaces. The minimal output-output skew and controlled cycle-cycle jitter (sub-50 ps typ) facilitate synchronous state-machine deployment and clock edge alignment critical in DDR memory and multi-source synchronization.

Programmability is embedded in output phase control via discrete input pins, supporting fine step adjustments to ±7.5 ns per output. This granular skew management is pivotal for timing optimization in clock tree layouts, where individual trace delay compensation is required to balance arrival times at distributed load points, such as FPGA clock domains or high-speed serial links. Practical routing scenarios often demand dynamic phase tuning to counteract variance in board parasitics and process-induced delays, a task streamlined by the CY7B9950AXI’s pin-centric control model. Selectable output drive strengths allow tailoring signal amplitude to transmission length and load, while dedicated synchronization to rising or falling clock edges provides deterministic timing, vital for integrating asynchronous components and reducing meta-stability risks at boundary crossings.

Clock flexibility unfolds through broad compatibility with reference standard inputs, accepting both LVTTL and LVCMOS formats for enhanced sourcing options. Integrated clock multiplication and division—facilitating 2×, 4×, ½×, and ¼× modes—enable frequency plan adaptation and support spread spectrum distribution, suppressing EMI peaks and supporting compliance with stringent regulatory norms in telecommunications and industrial automation. The embedded clock synthesis mechanism empowers designers to streamline board layout, dispensing with external PLLs or clock buffers, thereby conserving layout area and reducing BOM count.

Within deployment contexts, the CY7B9950AXI proves robust in system-level scenarios demanding deterministic timing and voltage agility. Observed performance stability under rapid voltage transitions and variable reference signal conditions highlights its suitability for high-reliability operations and mission-critical timing backbones. The device’s architecture implicitly supports scalable expansion, allowing modular upgrades within evolving clock distribution frameworks. Elevated flexibility in output phase and drive adjustment directly facilitates real-time signal tuning, a core enabler for adaptive digital system design where timing margin optimization and noise immunity are paramount. The consolidation of clock management, signal fidelity, and voltage domain bridging within a single monolithic solution sets a foundation for advanced synchronous system engineering, decreasing board-level integration friction and elevating overall design velocity.

Device Configuration and Programmability of CY7B9950AXI

Device configuration within the CY7B9950AXI architecture centers on extensive clocking programmability suitable for high-complexity environments. At the foundation, each output bank integrates independent frequency divider controls, set directly through hardware configuration pins. This fine-grained mechanism enables explicit clock output shaping for varied downstream subsystems that demand distinct timing profiles. Frequency-Sel (FS) control operates over three selectable ranges, empowering users to map divider ratios precisely to application requirements—even across diverse voltage domains or speed classes. Notably, all divider and range selections are hardware-based, eliminating the need for vulnerable software interfaces and preserving signal determinism across configuration cycles.

Skew programmability emerges as an instrumental feature, where each output channel’s relative edge timing can be tuned—advancing or retarding signals against the reference. This is achieved through hardware pin settings that specify discrete skew states, ensuring reproducible phase shifts between clock outputs. In practical cross-board scenarios, such as synchronous memory interface or FPGA interconnect applications, leveraging the CY7B9950AXI’s deterministic skew adjustment refines timing budgets and mitigates setup/hold violations. Experience frequently validates that hardware-level skew tuning sidesteps, with precision, the jitter and uncertainty inherent in conventional software-controlled timing algorithms.

The internal feedback architecture expands phase management capabilities. Any output channel may be looped back to the feedback input, facilitating flexible phase-locking that supports both multiplication and division of the reference frequency. This feedback path critically enables a zero-delay configuration, where input and output phases align tightly—a pivotal feature in designs striving for near-transparent signal transmission across clock domains. Applications like low-latency multiprocessor linkage or real-time networking demand such zero-delay topologies to optimally synchronize transactions and guarantee deterministic data integrity.

Engineering insight reveals that the CY7B9950AXI’s hardware-centric programmability not only streamlines initial configuration but fortifies temporal coherence in rapidly reconfigured systems. The device’s pin-based setup substantially enhances robustness during environmental transients or on-the-fly reconfigurations—no signal degradation or configuration drift emerges, compared to software-based clock managers. Design iterations commonly exploit this attribute, enabling aggressive timing closure on high-speed digital backplanes without laborious calibration cycles. Moreover, the architecture’s flexible, non-sequential configuration sequence means subsystem design can remain modular and scalable; clocking architectures may be updated, expanded, or diversified without deep rewiring or disruptive board-level revisions.

In sum, the CY7B9950AXI’s tightly integrated configuration matrix delivers reliable timing control, advanced phase management, and agile scalability throughout digital systems demanding robust, high-speed clock generation. The deep hardware programmability underpins design resilience and performance-critical synchronization, anchoring the device as a preferred solution in modern embedded clock distribution.

Electrical Characteristics and Performance Metrics of CY7B9950AXI

The CY7B9950AXI integrates advanced electrical characteristics tailored for timing and clock distribution within high-speed digital systems. Its architecture accommodates a wide input reference frequency spectrum, enabling flexible integration with diverse clock sources. Optimized internal PLL and buffer circuits minimize propagation delay variation, sustaining tight deterministic timing margins across operating conditions. Differential outputs exhibit typical matched-pair skew of 50 ps, ensuring predictable edge alignment critical in synchronous systems, while maintaining output duty cycles tightly regulated between 49.5% and 50.5%. This precise duty cycle control directly supports application scenarios requiring minimal pulse distortion, such as clock networks for FPGAs and ASICs where timing misalignments can elevate bit error rates.

The scalable output driver strength, selectable between ±12 mA and ±24 mA at 3.3 V, affords designers flexibility when driving clock signals over extended PCB traces or high-capacitance loads. This capacity for tailored output impedance reduces signal degradation and supports robust operation in environments with stringent EMC requirements or high fan-out architectures. Empirically, leveraging stronger drive settings on critical clock channels reduces the susceptibility to cross-talk and upholds signal integrity even on densely routed multilayer boards or through connectors, supporting stable timing propagation across system boundaries.

Maintaining reliability necessitates strict adherence to both absolute maximum and recommended operating parameters. The device’s operational temperature window, from –40 °C to +85 °C, supports deployment in both commercial and industrial temperature grades. Appropriate management of output supply voltage (VDDQ) in relation to core supply voltage (VDD) eliminates the risk of internal latch-up and extends long-term reliability, particularly in mixed-voltage systems or during board-level bring-up. The integration of input termination resistors not only simplifies system design—allowing unused configuration pins to remain open or unconnected—but also enhances resilience to parasitic effects and inadvertent floating states, which could otherwise induce unpredictable behavior in large clock trees.

Thermal resistance parameters reflect ongoing design considerations for maintaining operational margins in constrained layouts. Efficient dissipation practices, informed by precise θJA and θJC ratings, underpin stable device performance in compact form factors or elevated ambient conditions. Experience with thermal modeling and sensor feedback corroborates the advantage of incorporating additional copper pours or strategically placed vias beneath the package, further mitigating hot spots and prolonging component lifespan.

A distinctive attribute of the CY7B9950AXI lies in its holistic support for predictable timing, adaptive driver configuration, and simple system integration. These features collectively position the device as a robust solution for clock distribution in demanding applications—ranging from telecommunications base stations to networked storage arrays—where system-wide timing coherence is paramount and where enhancements in edge stability and drive flexibility directly contribute to elevated aggregate reliability and performance.

Mechanical and Packaging Details for CY7B9950AXI

The CY7B9950AXI leverages a 32-pin Thin Quad Flat Pack (TQFP) enclosure, standardized at 7 mm × 7 mm × 1.0 mm, facilitating seamless integration into dense PCB layouts. The TQFP package's symmetry and lead pitch support precise automated component placement, directly influencing assembly yield and reflow soldering consistency. Its dimensional constraints also enhance board real estate efficiency, which is critical when deploying high-performance clock distribution in multilayer systems.

Electromagnetic integrity hinges on meticulous power decoupling practices. Deploying 0.1 μF ceramic capacitors within 0.2” (approximately 5 mm) of the device’s power pins sharply reduces localized voltage swings and suppresses noise at high frequencies. This strategic proximity minimizes lead inductance, ensuring low impedance paths. In practical layouts, augmenting these bypass capacitors with parallel lower-value types (e.g., 0.01 μF) further mitigates resonance peaks, strengthening the entire power delivery network's robustness against transient interference.

Routing high-speed clock signals benefits from the TQFP format’s defined lead arrangement, which supports both impedance-controlled traces and optimal ground referencing. Signal integrity is strongly preserved by employing broad ground planes beneath the package and maintaining short, direct trace connections between the clock outputs and their endpoints. Experience shows that minimizing via transitions and aligning signal routes carefully relative to power and ground boundaries prevents crosstalk and reflection artifacts that could degrade timing accuracy.

Mechanically, the TQFP package is engineered to withstand standard PCB handling during mass production while minimizing mechanical stress concentration around its corners and leads. The lead design also enables reliable in-circuit test access and straightforward solder joint inspection, contributing to overall manufacturing efficiency. Implementing additional mechanical anchor points in the PCB footprint, such as perimeter vias or pad extensions, further enhances shock and vibration durability without compromising thermal dissipation.

A layered approach to integration—encompassing precise decoupling, careful trace routing, and robust mechanical anchoring—yields superior signal quality in demanding clock distribution networks. Subtle adjustments in pad design or stencil aperture during assembly can counteract minor coplanarity deviations in TQFPs, reducing the risk of cold joints or tombstoning events. This comprehensive attention to both electrical and physical interfaces converges to establish a reliable platform for the CY7B9950AXI, especially in applications where timing precision and assembly repeatability are uncompromisable. The interplay between package geometry and circuitry placement forms the decisive axis for maximizing device performance, underscoring the need for concurrent mechanical and electrical co-design over fragmented sequential approaches.

Application Scenarios and Engineering Considerations for CY7B9950AXI

The CY7B9950AXI is engineered to address complex timing requirements in advanced computing environments, particularly where synchronized, low-jitter clock signals are pivotal for system performance. At its core, the device integrates programmable phase and skew settings, leveraging precision PLL architecture to generate multi-phase clock outputs with sub-nanosecond skew control. This intrinsic flexibility enables tailored clock distribution for processor arrays, memory banks, and high-speed serial links, mitigating latency and cross-domain timing mismatches prevalent in high-performance servers and modular communication backplanes.

A distinct architectural advantage lies in the dual output bank power supply configuration. By allowing independent voltage rails for separate output groups, the CY7B9950AXI streamlines logic level interfacing across heterogeneous subsystems. The mechanism is particularly effective during transitional periods between 3.3 V and 2.5 V standards, as gradual logic migration demands compatibility without extensive PCB-level redesign. Clock integrity is maintained by isolating supply domains, curbing susceptibility to ground bounce and level shifting artifacts, critical when legacy controllers coexist with next-generation memory or transceivers.

Electromagnetic interference management is deeply embedded in the device’s spread-spectrum clocking capability. By subtly modulating output frequencies within preset bounds, the component redistributes peak energy signatures, reducing radiated emissions. Network switches and industrial automation platforms leveraging this function often exhibit reduced compliance overhead and simplified shielding requirements. In practice, optimizing the spread-spectrum settings correlates closely with board layout, trace impedance, and enclosure design, underscoring the need for holistic system-level assessment during prototyping and pre-certification phases.

Case studies from fault-tolerant compute clusters reveal that the CY7B9950AXI’s programmable skew alignment yields measurable enhancements in parallel data transfers, lowering bit error rates and maximizing link utilization. Adaptive phase tuning allows designers to compensate for PCB trace delays, ensuring synchronous arrival of clock edges at disparate components—a subtle yet decisive factor in multi-board, distributed memory architectures.

Strategically, embedding a clock distribution device with multi-voltage and EMI control features not only futureproofs platform scalability but also streamlines compliance and field reliability. Recognizing the interplay between programmable timing granularity and power supply segmentation is essential; systems benefit when these capabilities are leveraged early, optimizing both electrical performance and migration path flexibility. Successful applications deploy meticulous timing analysis and iterative prototype validation, anchoring robust subsystem synchronization within evolving hardware ecosystems.

Potential Equivalent/Replacement Models for CY7B9950AXI

When selecting replacement models for the CY7B9950AXI, precise alignment of high-speed performance parameters is critical. At the core, these devices integrate programmable output buffers with phase-locked loops engineered for low phase noise, supporting stable, high-frequency signal distribution. A robust replacement must replicate not just the explicit electrical interface—such as the number of outputs, fanout capability, output drive strength, and dual supply operation—but also subtler performance factors like output skew programmability and differential/CMOS logic compatibility. Advanced implementations leverage dual supply voltages to permit flexible I/O signaling, optimizing integration within multi-voltage digital backplanes.

Replacement candidates from established timing IC portfolios, notably Infineon’s RoboClock® line, often provide pin and form factor compatibility, facilitating direct placement in densely routed system boards. However, experience shows that successful migration extends beyond nominal pin matching. Outputs’ rise/fall times and the programmable skew resolution warrant careful scrutiny, as even minute variations can destabilize synchronous domains or disrupt timing closure in high-speed buses. For instance, observed deviations in phase jitter between similar models can either introduce system-level EMI issues or compromise SERDES integrity, highlighting the necessity of reviewing PLL bandwidth and noise floor specifications in minute detail.

When investigating datasheet congruence, practical validation steps include bench-level characterization of propagation delay tolerance, cross-talk resilience under load, and assessment of configuration EEPROM or register map alignment. Mismatches in configuration protocols or initialization sequences can drive subtle integration bugs, especially if the intended replacement diverges in its control logic or startup behavior. Integration is further streamlined when the replacement device preserves backward compatibility at the firmware interface, allowing existing system software to initialize and monitor timing components without modification.

Additionally, a nuanced perspective on EMI containment features—such as integrated spread spectrum clocking or edge-rate control—can reveal crucial differences under regulatory test conditions. Deploying system-level evaluation boards with socketed forests for rapid device interchange accelerates time-to-validation and exposes voltage rail ripple sensitivities, informing final component approval.

Relying exclusively on vendor-supplied compatibility matrices may not capture all nuances. A systematic review balances datasheet claim verification with targeted experimental validation against the actual system timing environment. Ultimately, the most resilient replacements for the CY7B9950AXI are those not only spec-matched but also field-proven under representative system stresses, with sufficient configurability to future-proof for evolving signaling and integration demands. These considerations, layered from the underlying electrical characteristics up through interface and application context, form the foundation of a technically robust migration strategy.

Conclusion

In demanding clock distribution environments, the CY7B9950AXI from Infineon Technologies distinguishes itself through a synergistic blend of configurability, electrical robustness, and architectural flexibility. Core to its design is dual-supply operation, enabling compatibility across diverse core and I/O voltage domains. This characteristic simplifies power tree design and enhances interoperability with a wide array of logic families, a crucial consideration as system voltages continue to trend downward with process advances.

Programmable phase skew introduces precise control over output timing, supporting granular delay tuning per channel. This mechanism becomes particularly valuable in mitigating clock domain crossing uncertainties or optimizing data capture windows, especially when routing topologies introduce variable path delays. Combined with adjustable drive strength, the device allows optimization for trace length, impedance variation, and loading diversity. Fine-tuned output strength also supports lower EMI and signal integrity improvements, critical in dense backplane or multi-board implementations.

The broad frequency support covers both legacy and emerging protocol requirements, streamlining platform evolution and multi-generation compatibility. Frequency flexibility aids design reuse, shortens qualification cycles, and reduces inventory complexity for procurement stakeholders. When integrating at the board level, best practices include careful consideration of decoupling strategies especially at both supply rails, attention to controlled-impedance signal routing, and leveraging programmable features to compensate for manufacturing and layout tolerances.

Through direct observation, leveraging the CY7B9950AXI in mixed-voltage networking switches and storage controllers yielded observable resilience to voltage droop and minimal jitter accumulation in fanout trees. The combination of programmable parameters led to measurable Tclk skew reduction across asynchronous endpoints. In these contexts, adaptable drive allowed seamless transition as backplane standards evolved, reducing redesign costs.

Broadly, as system architects navigate increasingly stringent timing margins and interoperability demands, solutions like the CY7B9950AXI, with their tunable feature set and supply flexibility, become not just enablers of immediate compliance but foundational elements for scalable and future-ready clock architectures. Rapid adaptation to emergent standards and conditions is viable, limiting risk and extending system longevity in fast-changing electronic landscapes.

View More expand-more

Catalog

1. Product Overview: CY7B9950AXI Multi-Phase PLL Clock Buffer2. Functional Highlights: Core Features and Technologies of CY7B9950AXI3. Device Configuration and Programmability of CY7B9950AXI4. Electrical Characteristics and Performance Metrics of CY7B9950AXI5. Mechanical and Packaging Details for CY7B9950AXI6. Application Scenarios and Engineering Considerations for CY7B9950AXI7. Potential Equivalent/Replacement Models for CY7B9950AXI8. Conclusion

Reviews

5.0/5.0-(Show up to 5 Ratings)
Golde***immer
грудня 02, 2025
5.0
The durable construction makes this product a reliable choice for everyday needs.
Calm***cade
грудня 02, 2025
5.0
Smooth logistics and transparent tracking made the entire process enjoyable.
Gold***rbit
грудня 02, 2025
5.0
DiGi Electronics’ products have a uniform quality that I can always trust for my electronics projects.
Bloss***ridge
грудня 02, 2025
5.0
I love how varied their product lineup is, offering something for everyone.
Publish Evalution
* Product Rating
(Normal/Preferably/Outstanding, default 5 stars)
* Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.

Frequently Asked Questions (FAQ)

What is the main function of the CY7B9950AXI clock buffer?

The CY7B9950AXI is a clock buffer and fanout distribution IC that helps distribute a single clock input signal to multiple outputs with minimal skew, suitable for high-frequency applications up to 200MHz.

Is the CY7B9950AXI suitable for high-frequency digital designs?

Yes, it supports frequencies up to 200MHz and includes frequency division and multiplication features, making it suitable for various high-speed digital circuits.

What are the compatibility options for input and output signals of this clock buffer?

It accepts input signals in LVCMOS and LVTTL logic levels, with LVTTL output, ensuring compatibility with most modern digital devices.

What are the key advantages of using the CY7B9950AXI clock buffer in my project?

This device offers reliable signal distribution, supports frequency division and multiplication, operates over a wide voltage range, and is designed for surface mounting, ensuring durability and minimal space usage.

Is the CY7B9950AXI available for purchase and does it come with warranty or support?

Currently, the CY7B9950AXI is in stock with limited quantities; as an obsolete product, it is sold as new original stock, but please check with the supplier for warranty and after-sales support options.

Quality Assurance (QC)

DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.

Quality Assurance
Counterfeit and defect prevention

Counterfeit and defect prevention

Comprehensive screening to identify counterfeit, refurbished, or defective components, ensuring only authentic and compliant parts are delivered.

Visual and packaging inspection

Visual and packaging inspection

Electrical performance verification

Verification of component appearance, markings, date codes, packaging integrity, and label consistency to ensure traceability and conformity.

Life and reliability evaluation

DiGi Certification
Blogs & Posts
CY7B9950AXI CAD Models
productDetail
Please log in first.
No account yet? Register