CY2305CSXC-1 >
CY2305CSXC-1
Infineon Technologies
IC FANOUT BUFFER 8SOIC
2208 Pcs New Original In Stock
Fanout Buffer (Distribution), Zero Delay Buffer IC 133.33MHz 1 8-SOIC (0.154", 3.90mm Width)
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CY2305CSXC-1 Infineon Technologies
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CY2305CSXC-1

Product Overview

6325584

DiGi Electronics Part Number

CY2305CSXC-1-DG
CY2305CSXC-1

Description

IC FANOUT BUFFER 8SOIC

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2208 Pcs New Original In Stock
Fanout Buffer (Distribution), Zero Delay Buffer IC 133.33MHz 1 8-SOIC (0.154", 3.90mm Width)
Quantity
Minimum 1

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CY2305CSXC-1 Technical Specifications

Category Clock/Timing, Clock Generators, PLLs, Frequency Synthesizers

Manufacturer Infineon Technologies

Packaging Tube

Series -

Product Status Active

DiGi-Electronics Programmable Not Verified

Type Fanout Buffer (Distribution), Zero Delay Buffer

PLL Yes

Input Clock

Output Clock

Number of Circuits 1

Ratio - Input:Output 1:5

Differential - Input:Output No/No

Frequency - Max 133.33MHz

Divider/Multiplier No/No

Voltage - Supply 3V ~ 3.6V

Operating Temperature 0°C ~ 70°C

Mounting Type Surface Mount

Package / Case 8-SOIC (0.154", 3.90mm Width)

Supplier Device Package 8-SOIC

Base Product Number CY2305

Datasheet & Documents

HTML Datasheet

CY2305CSXC-1-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
2015-CY2305CSXC-1
CYPCYPCY2305CSXC-1
CY2305CSXC-1-DG
CY2305CSXC1
428-2193-5
SP005644171
2156-CY2305CSXC-1
428-2193-5-DG
448-CY2305CSXC-1
2832-CY2305CSXC-1-428
Standard Package
97

CY2305CSXC-1 Clock Fanout Buffer from Infineon Technologies: Technical Deep Dive and Selection Guide

Product Overview of CY2305CSXC-1 Clock Fanout Buffer

The CY2305CSXC-1, a clock fanout buffer engineered by Infineon Technologies, serves as a precise solution for clock signal management in high-density electronic systems. Operating at 3.3 V, this zero-delay buffer leverages a tightly integrated phase-locked loop (PLL) mechanism, enabling deterministic synchronization between its single clock reference input and five parallel outputs. The importance of zero delay distribution lies in mitigating clock skew across multiple nodes, which is essential for coherent data transfers, particularly in systems with tightly coupled timing domains such as memory modules, communications infrastructures, and multi-processor designs.

At its core, the internal PLL functions by dynamically aligning the output phase with the incoming reference signal, correcting for any propagation disparities inherent in conventional buffer topologies. This closed-loop correction process, when properly implemented, results in output channels exhibiting sub-nanosecond skew, even across moderate trace lengths and under variations in supply voltage or temperature. The SOIC-8 packaging facilitates compact PCB layouts and simplifies integration where board real estate constraint is a key factor; pin assignment has been optimized to reduce ground bounce while minimizing crosstalk.

Device deployment in multi-board or large backplane environments benefits from the CY2305CSXC-1’s stable output drive strength and symmetrical rise/fall characteristics, which collectively help maintain edge integrity at GHz-class operating frequencies. In real-world scenarios, clock tree designers routinely observe that system-wide jitter is significantly suppressed, directly attributable to the PLL’s capability to absorb disturbances and align timing edges across multiple receiver domains. Selection of the input reference frequency—a typical range between 10 MHz and 133 MHz—enables the buffer to target a broad spectrum of applications, from microcontroller synchronization to high-speed networking ASIC clocking.

A notable design challenge involves matching impedance and controlling trace parasitics to fully harness the low-output skew promises of the buffer. PCB routing practices, including controlled line geometry and careful partitioning of the power supply planes, are instrumental in sustaining optimal timing performance. Placement close to source clock generators and maintaining short, even-length output traces further improves phase relationships. In practical deployments, subtle adjustments to layout and power filtering can reveal measurable improvements in output uniformity, often exceeding datasheet specifications with disciplined engineering.

From a broader perspective, the CY2305CSXC-1 exemplifies a trend towards highly integrated clock buffer architectures that overcome legacy constraints of signal distribution, such as fixed delays and susceptibility to environmental fluctuations. Its ability to scale output channels while preserving synchronous timing positions it as a preferred choice for system implementations demanding rigorous timing control—underpinning modern digital convergence where reliability and throughput are directly coupled to clock subsystem performance. The move toward zero-delay buffering reflects a strategic shift: effective clock distribution is no longer a peripheral design concern but foundational to the stability and efficiency of contemporary electronic platforms.

Key Features and Functional Description of CY2305CSXC-1

The CY2305CSXC-1 provides a precision solution for clock distribution, integrating advanced design principles to address the challenges found in multi-frequency clock networks. At its core, this device supports a wide operating frequency range, from 10 MHz up to 133 MHz depending on the variant, accommodating both legacy and contemporary system requirements. The topology is defined by a single input driving five outputs, each matched to achieve low output-to-output skew, essential for synchronous data transfer and minimal timing uncertainty across distributed subsystems.

A distinguishing attribute is the zero input-to-output propagation delay architecture. By adopting an on-chip phase-locked loop (PLL) with internal feedback routed through the CLKOUT pad, the device ensures clock outputs consistently align with the reference input, even as external loading conditions or board layout variations arise. This intrinsic mechanism eliminates the cascading delays typical of discrete fanout buffer implementations, leading to simplified timing closure during board design.

Low jitter—typical cycle-to-cycle variation held at 50 ps—enables the CY2305CSXC-1 to maintain high signal integrity in environments sensitive to phase noise, directly benefiting applications such as high-performance communications, memory interfaces, and precision industrial instrumentation. The combination of low jitter and minimal skew ensures that downstream timing margins are preserved, improving system robustness and reducing the margin of error in closed-loop control designs.

Integrated power management is paramount, highlighted by the support for an ultra-low current power-down mode. When the reference clock is absent, the device’s quiescent current drops below 12 μA in commercial-grade configurations and remains below 25 μA for industrial or automotive-qualified variants. This mode prolongs system endurance in battery-critical designs and aligns with regulatory demands for low-power operation in always-on embedded platforms.

The offering includes industrial (-I) and automotive-A (-A) classified models, extending operational reliability under thermal, electrical, and mechanical stresses. This flexibility factors directly into platform scalability and product qualification cycles, particularly where clock devices must comply with extended temperature ranges or automotive compliance standards.

For specialized drive requirements, the CY2305C-1H variant features increased output drive strength and expedited edge rates, preserving signal fidelity at elevated operating frequencies up to 133 MHz. This addresses scenarios involving high-capacitance traces or long PCB routes, where standard outputs may exhibit signal degradation or timing skew.

Direct die-replacement compatibility with previous CY2305 generations minimizes disruption in mature designs while offering an upgrade path toward enhanced performance without schematic or layout overhaul. Such backward-compatible design decisions accelerate adoption in established product lines, reducing requalification efforts and sustaining field-proven architectures.

From firsthand deployment, leveraging the zero-delay feedback and tight skew characteristics has consistently reduced timing analysis complexity, especially in FPGAs or multi-board backplane configurations. Careful trace length matching and consideration of load balancing among the outputs further optimize timing uniformity, maximizing the inherent benefits of the internal PLL scheme.

An often underappreciated value lies in the device’s deterministic timing behavior, which simplifies system-level debug and makes boundary scan or in-system configuration more predictable. Designing with this buffer accelerates system validation, particularly in applications where synchronized operation of multiple subsystems is the bottleneck for product maturity.

The CY2305CSXC-1 exemplifies a class of devices where architectural simplicity and robust electrical characteristics converge, enabling scalable clock frameworks for high-reliability systems. The ability to seamlessly integrate into a variety of platforms—while providing enhanced timing performance, low power consumption, and consistent pin-compatibility—marks it as a reference solution for contemporary clock distribution challenges.

Pin Configuration and Package Information for CY2305CSXC-1

Pin configuration for the CY2305CSXC-1 reveals a design intent focused on minimizing board complexity while maintaining signal integrity across clock distribution networks. The allocation of eight pins within a 150 mil SOIC package permits compact integration, essential for densely populated PCBs where routing constraints and part adjacency dictate layout choices. The package outline is standardized, mitigating complications in procurement cycles and facilitating direct drop-in replacement without requiring board redesigns—crucial for long-term maintenance and rapid prototyping.

Examining pin functionality, the reference clock input (REF) forms the cornerstone of timing stability, enabling synchronous clock generation and low-jitter operation throughout the downstream circuitry. The device offers five precisely matched clock outputs, with one (CLKOUT) internally routed for PLL feedback. This architecture enhances output phase alignment and ensures consistent clock edge relationships, a vital component in timing-sensitive digital systems—such as FPGAs, ASICs, and multi-domain microcontroller environments—where skew minimization translates to higher data integrity and fewer signal violations.

All output pins integrate weak pull-down resistors, imposing predetermined logic states when signals are undriven. This mechanism precludes erratic behavior arising from high-impedance or floating inputs, directly reducing the risk of metastability or unpredictable transitions during power sequencing, system reset, or reconfiguration events. Such robustness in idle state management is particularly advantageous in precision control applications or low-noise analog environments, where inadvertent clock glitches propagate measurement errors or logic faults.

In practical deployments, signal assignment and physical arrangement within the SOIC footprint simplify routing strategies for clock signals. Direct access to outputs enables designers to fan out synchronization domains with minimal trace length variation, optimizing electrical characteristics and minimizing reflections or crosstalk. The unification of core supply (VDD) and ground (GND) connections on clearly identified pins aids in clean power delivery and facilitates standardized decoupling practices, further enhancing overall system performance.

Notably, the uniformity of package and pin mapping among clock distribution ICs like the CY2305CSXC-1 serves as a strategic cornerstone for scalable platform development. The engineered predictability of pin states and logic level management enables seamless coexistence of heterogeneous components on shared clock planes, streamlining design cycles and reducing the burden of downstream testing. An implicit advantage emerges in the supply chain domain: procurement is insulated from disruption caused by package misalignment, expediting both volume manufacturing and field service updates.

In summary, the CY2305CSXC-1's pin configuration and package typology encapsulate a balance of integration, operational resilience, and logistical adaptability, lending itself to both immediate application and long-horizon platform evolution. The nuanced combination of weak pull-down logic management and standardized package easily translates into tangible engineering benefit—marked by increased uptime, tighter timing margins, and lower total cost of ownership in clock-distributed architectures.

Electrical and Switching Characteristics of CY2305CSXC-1

The CY2305CSXC-1 is engineered to address stringent requirements in signal integrity and timing precision for clock distribution networks. Its supply voltage specification of 3.3 V ±0.3 V facilitates integration with modern digital logic families, balancing noise margin and power consumption. The device’s absolute ratings—such as extended storage temperature tolerance from -65°C to +150°C and robust ESD protection exceeding 2,000 V—reflect design choices aimed at preserving reliability across diverse deployment scenarios, from lab prototyping to field environments frequently exposed to thermal and electrical stress.

Low output leakage in power-down mode highlights an architecture aligned with contemporary embedded platforms, where minimizing quiescent currents under standby conditions is essential for prolonged operational lifetimes. This attribute favors battery-powered and always-on systems, where every microamp of leakage impacts system autonomy.

Switching behaviors underpin synchronized clock propagation. The device ensures sharp, well-defined output transitions by controlling rise and fall times; this mitigates jitter, enhances edge placement, and minimizes EMI. Such control is critical in high-speed logic interfacing, where timing deviations can propagate errors or affect system throughput. The output skew—kept minimal between corresponding outputs—directly supports spatially distributed subsystems, such as those found in data acquisition arrays or multi-lane serial links, by sustaining temporal alignment across all clock channels. Furthermore, the input-to-output propagation delay, effectively engineered as negligible under balanced loading conditions, provides a transparent interface for upstream timing sources, safeguarding cycle-to-cycle determinism in synchronous designs.

Flexible operating temperature ranges enable deployment across sectors, extending from conventional commercial applications to more demanding contexts in automotive and industrial automation. Thermal resilience and consistent electrical parameters across the specified range eliminate the need for extensive temperature calibration or compensation mechanisms, reducing system complexity and validation overhead. Practically, such devices have demonstrated consistent output characteristics even when subjected to accelerated thermal cycling, supporting long-term system reliability.

From a design perspective, integrating the CY2305CSXC-1 into clock architectures facilitates scalable, low-skew fan-out while streamlining board-level routing. Its electrical predictability under diverse loads and environmental conditions enables tighter margin calculations and relaxed derating, which proves valuable in dense layouts or systems with aggressive timing budgets. Notably, the approach here elevates application reliability by combining physical robustness with tight electrical characterization, an alignment essential for next-generation time-critical systems in both hardware prototyping and production-scale deployment.

Zero Delay and Skew Control in CY2305CSXC-1 Applications

Zero delay in the CY2305CSXC-1 leverages a phase-locked loop (PLL) with a feedback path, establishing synchronous timing between the input and all outputs. This feedback aligns the divided output signals precisely with the incoming reference, effectively eliminating the cumulative phase shifts commonly introduced by buffer chains. The architecture’s robustness becomes apparent under varied board-level conditions, but absolute zero delay mandates meticulous alignment of output loading. Even unused CLKOUT pins must have termination or matching capacitive components, as imbalance injects measurable skews between nodes, degrading system-level timing integrity.

Delving into output-to-output skew control, the primary determinant is the capacitive load symmetry across all clock outputs. Minute variances in trace lengths or decoupling capacitance create localized propagation delays, making high-speed systems particularly sensitive to mismatches. To achieve practical zero skew, mirrored board layouts and tight impedance control are best practice. Real-world deployments reveal that minor layout inconsistencies or incomplete ground returns can induce sub-nanosecond errors, underscoring the need for pre-layout simulations and post-layout timing validation.

Deliberate input-to-output delay offsets, often required for timing margin optimization between subsystems, are achievable by adjusting load on the CLKOUT relative to other outputs. Empirical measurements, mapped in the CY2305CSXC-1 documentation, provide a quantifiable relationship between capacitive delta on CLKOUT and the resulting timing offset. This enables deterministic tuning without reconfiguring upstream signal sources. Precision in fine-tuning arises from iterative bench testing coupled with high-resolution oscilloscope measurements, referencing worst-case conditions described in datasheets.

A critical insight emerges from repeated signal integrity analyses: The interplay between layout parasitics and PLL dynamics limits the theoretical zero-delay specification unless board effects are tightly controlled. Thus, disciplined PCB design with matched trace routing and attention to return paths is non-negotiable. In advanced scenarios, employing additional test points near the outputs expedites skew characterization and long-term validation. This layered approach ensures the CY2305CSXC-1’s theoretical potential translates into reliable, low-skew clock distribution in jitter-sensitive designs such as FPGAs, high-speed serializers, and synchronous memory subsystems.

Typical Applications and Design Considerations for CY2305CSXC-1

The CY2305CSXC-1 serves as a high-performance clock driver, engineered to address the stringent requirements of sophisticated digital systems. Its underlying mechanism operates by receiving a single reference input and distributing low-skew clock outputs to downstream components, ensuring that timing relationships across multiple logic domains remain tightly controlled. Internal architecture offers advanced clock buffering, which is crucial for maintaining low propagation delay and minimizing duty cycle distortion—attributes essential for clock trees within microprocessor and FPGA-based systems.

In the context of high-speed data communication, the deterministic propagation delay and tight output-to-output skew of the CY2305CSXC-1 enable reliable data sampling and synchronized parallel interface operation. These characteristics prove especially advantageous when deploying high-throughput communication protocols, where phase misalignment directly translates to protocol errors or suboptimal system performance. Similarly, synchronous memory subsystems benefit from the device’s capability to maintain coherent timing, thereby safeguarding data integrity during concurrent address and data line transitions.

The device’s design supports robust operation in industrial and automotive environments by tolerating extended temperature ranges and fluctuating supply conditions. Its logic thresholds are immune to noise transients, which fortifies system reliability against both electromagnetic interference and voltage ripple—common challenging conditions in control and automation applications. Design practices should focus on preserving signal quality through disciplined PCB layout. Minimizing clock trace lengths and using controlled impedance routing prevents excessive reflections, while correct termination and careful estimation of aggregate output load capacitance ensures that edge rates remain within specification, avoiding undershoot or overshoot on sensitive nodes.

A subtle, yet pivotal, consideration lies in the deployment of ground referencing strategies. Dedicated ground planes and partitioned power domains form the basis for clean signal reference, preventing ground bounce and improving common-mode rejection. Furthermore, leveraging the device’s tolerance to input signal swing increases design flexibility, allowing integration with a broad spectrum of logic families without external translation components.

Evaluating performance under actual load and temperature extremes often exposes system-level vulnerabilities. For instance, power rail transients can induce skew variations if not mitigated. Proactive margining during validation—applying worst-case supply and environmental stress—confirms the CY2305CSXC-1's robust operation envelope and identifies potential weaknesses in power supply filtering or PCB design. This engineering discipline not only guarantees compliance with static datasheet limits but also ensures sustained reliability over the system’s operational life.

Strategic application of the CY2305CSXC-1 enables advanced clocking topologies, such as hierarchical tree networks in multi-board systems. Here, its low additive jitter and consistent phase alignment allow seamless expansion without introducing cross-domain timing uncertainties. This flexibility makes it an indispensable building block for scalable embedded platforms, where clock quality underpins overall computational accuracy and communication efficiency. Integrating these insights into clock architecture planning reduces design iteration cycles and fortifies product robustness from concept through field deployment.

Potential Equivalent/Replacement Models for CY2305CSXC-1

Evaluating alternative clock buffer ICs for the CY2305CSXC-1 requires a systematic approach grounded in functional equivalence, pin mapping, and electrical specifications. The Infineon CY2309C series emerges as a strong candidate, notably extending output capability with nine lines structured in 4+4+1 banks, which enhances design flexibility for complex multi-domain clock distribution. Additional test modes, such as PLL bypass, facilitate in-system bring-up and debug, especially during prototype validation phases where isolation of clock sources is critical for signal integrity assessment.

For designs rooted in legacy architectures, the original CY2305 offers near-direct drop-in compatibility where inventory exists. However, attention should be paid to suffix variations such as the -1H grade, which are engineered for higher frequency operation and improved output drive—an essential consideration in environments exceeding 100 MHz or where board-level capacitances challenge conventional buffer output swing. Integration in such cases mandates precise impedance matching and layout optimization to minimize reflections and maintain signal fidelity.

Successful sourcing of equivalent parts hinges on thorough cross-verification of pinout schemes, output timing relationships, and electrical limits. Subtle discrepancies in propagation delay, output symmetry, or input slew rate may manifest as timing violations at system boundaries, impacting downstream logic and synchronization robustness. Model selection should not only account for nominal specifications but also incorporate margin analyses under worst-case process and environmental variation.

In practice, deploying alternative buffers often reveals nuanced layout interactions, such as differences in thermal dissipation given altered package geometries, or unanticipated mutual coupling between output banks in high-density implementations. Effective transition strategies prioritize staggered roll-outs and selective A/B validation across critical path nodes. Leveraging devices with inbuilt test and bypass functionalities aids in isolating migration-related anomalies without interrupting full system operation.

Ultimately, the decision matrix should balance immediate compatibility with future scalability, favoring models that integrate diagnostic capabilities and broader drive options. This approach ensures supply resilience while supporting ongoing platform evolution, reflecting a preference for modular upgrade paths within clock tree architectures. Such insights underline the importance of aligning component selection with both present system constraints and anticipated design trajectories.

Conclusion

The CY2305CSXC-1 from Infineon Technologies demonstrates sophisticated integration of clock distribution technology, targeting environments where zero-delay and low-skew signal propagation are essential for system timing integrity. At the architectural level, its core mechanism leverages phase-aligned outputs, minimizing propagation delay differences and ensuring synchronous clock domains. This zero-delay performance is accomplished through a feedback loop architecture, which actively compensates for load and process variations, supporting consistently tight timing parameters. Low output skew and robust jitter characteristics are maintained even under dynamic supply voltage and temperature conditions, which is critical in both automotive and industrial-grade deployments.

Operational flexibility is further enhanced by the device’s multi-format output capability and versatile input compatibility. The CY2305CSXC-1 supports a broad voltage range and can be precisely configured for varied clock sources, simplifying integration into both legacy and next-generation platforms. Its packaging is engineered for spatial efficiency, accommodating dense PCB layouts often encountered in modular controller designs and embedded applications. Automotive compliance and extended temperature range fortify its resilience, allowing seamless deployment in powertrain subtasks, industrial motor controls, and advanced sensor synchronization applications, where thermal and electrical stressors are routine.

During prototyping and volume ramp, streamlined design-in procedures can be observed with the CY2305CSXC-1 due to its predictable signal characteristics and well-documented electrical specifications. Pin-compatible variants and related product families offer scalable options for requirements such as higher drive currents or expanded output counts, reducing the friction associated with design extensibility or mid-project feature additions. This interoperability across buffer product lines translates to procurement advantages, as supply chain adaptability is reinforced by multi-sourced package types and broad industry availability.

A frequently underestimated facet is the buffer’s role in reducing board timing closure cycles. When paired with well-characterized PLLs and low-inductance PCB trace design, the device functions as a timing anchor point, enabling engineers to fine-tune critical path delays with high repeatability. In complex digital systems where timing convergence is a bottleneck, deploying a solution with integrated zero-delay and low-skew properties improves overall time-to-market and reduces iterative rework.

The CY2305CSXC-1 thus serves not only as a functional clock buffer, but as an enabler within timing-sensitive, space-constrained environments, balancing reliability and configurability. Careful examination of package footprint, available variants, and supply resilience should accompany performance assessments, especially for projects emphasizing lifecycle longevity and future-proof integration. The blend of electrical precision, application breadth, and ecosystem support positions the CY2305CSXC-1 as a foundational component for current and evolving timing architectures in the digital domain.

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Catalog

1. Product Overview of CY2305CSXC-1 Clock Fanout Buffer2. Key Features and Functional Description of CY2305CSXC-13. Pin Configuration and Package Information for CY2305CSXC-14. Electrical and Switching Characteristics of CY2305CSXC-15. Zero Delay and Skew Control in CY2305CSXC-1 Applications6. Typical Applications and Design Considerations for CY2305CSXC-17. Potential Equivalent/Replacement Models for CY2305CSXC-18. Conclusion

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Frequently Asked Questions (FAQ)

What is the main function of the CY2305CSXC-1 fanout buffer IC?

The CY2305CSXC-1 is a zero delay fanout buffer designed to distribute a clock signal to multiple outputs with minimal delay, ensuring synchronized timing in electronic systems.

Is the CY2305CSXC-1 compatible with standard surface mount PCB designs?

Yes, this IC comes in an 8-SOIC surface mount package, making it suitable for standard PCB assembly and compact electronic devices.

What are the electrical specifications and maximum frequency of this fanout buffer?

The CY2305CSXC-1 operates at a maximum frequency of 133.33MHz and requires a supply voltage between 3V and 3.6V for optimal performance.

Can the CY2305CSXC-1 be used in temperature-sensitive environments?

This IC is designed for an operating temperature range of 0°C to 70°C, suitable for standard commercial applications but not for extreme temperature environments.

What are the advantages of choosing the CY2305CSXC-1 clock buffer for my project?

It offers low propagation delay, high reliability, and compliance with RoHS standards, making it ideal for precise clock distribution in professional electronic designs.

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