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BAV101
Diotec Semiconductor
DIODE SUPERFAST MINIMELF 110V
83318 Pcs New Original In Stock
Diode 100 V 200mA Surface Mount DO-213AA, MINI-MELF
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5.0 / 5.0
- (85 Ratings)
BAV101
Product Overview
12944483
DiGi Electronics Part Number
BAV101-DGManufacturer
Diotec Semiconductor
BAV101
Description
DIODE SUPERFAST MINIMELF 110VInventory
83318 Pcs New Original In Stock
Diode 100 V 200mA Surface Mount DO-213AA, MINI-MELF
Quantity
Minimum 1
Minimum 1
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BAV101 Technical Specifications
Category
Diodes, Rectifiers, Single Diodes
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Technology
Standard
Voltage - DC Reverse (Vr) (Max)
100 V
Current - Average Rectified (Io)
200mA
Voltage - Forward (Vf) (Max) @ If
1.25 V @ 200 mA
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
50 ns
Current - Reverse Leakage @ Vr
5 µA @ 100 V
Capacitance @ Vr, F
-
Mounting Type
Surface Mount
Package / Case
DO-213AA
Supplier Device Package
DO-213AA, MINI-MELF
Operating Temperature - Junction
-50°C ~ 175°C
Datasheet & Documents
Datasheets
Download BAV101 Product Specification (PDF)
HTML Datasheet
BAV101-DG
Environmental & Export Classification
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8541.10.0000
Additional Information
Other Names
2796-BAV101TR
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
Tracking information is accurate and updates regularly.
грудня 02, 2025
Shipping is always faster than expected—greatly enhancing my shopping experience.
грудня 02, 2025
Their reliability in both shipping speed and product durability keeps me a loyal customer.
грудня 02, 2025
I value their commitment to providing affordable solutions paired with excellent after-purchase support.
грудня 02, 2025
The quality of their products contributes significantly to the success of my repairs.
грудня 02, 2025
Overall, an outstanding experience driven by professional support and fast delivery.
грудня 02, 2025
The after-sales team is proactive and always ensures customer satisfaction.
грудня 02, 2025
The professionalism and friendliness of their team are truly standout qualities.
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Frequently Asked Questions (FAQ)
Can the BAV101 be used as a drop-in replacement for the MMBD914 in high-speed switching circuits, and what design risks should I consider?
The BAV101 can serve as a functional alternative to the MMBD914 in many high-speed switching applications, but careful evaluation is required. Both devices are small-signal, surface-mount diodes with fast reverse recovery (50 ns for BAV101), but the MMBD914 typically has a lower forward voltage drop (~1.1V vs. 1.25V @ 200mA) and tighter leakage specs. In high-temperature environments nearing 150°C, the BAV101's 5 µA leakage at 100 V may increase signal loss or noise in precision circuits. Additionally, while package compatibility (MINI-MELF DO-213AA) is identical, thermal performance differs due to construction variances—ensure your PCB layout provides adequate thermal relief. Always verify switching waveforms under load to catch timing discrepancies during replacement design-in.
How does the BAV101 perform in ESD protection or clamping roles despite not being marketed as a protection diode?
While the BAV101 isn't a dedicated TVS or ESD protection diode, its 50 ns reverse recovery time and 100 V DC blocking capability allow limited use in low-energy signal line clamping, such as protecting GPIO or sensor inputs from minor transients. However, it lacks controlled breakdown characteristics and high peak pulse power handling. If replacing a transient protection device like the SMAJ series, the BAV101 would fail under moderate ESD events (e.g., IEC 61000-4-2). For robust clamping, pair the BAV101 with a proper ESD suppressor or use it only for back-to-back steering in signal integrity conditioning, not standalone protection.
What are the reliability risks when operating the BAV101 at its maximum junction temperature of 175°C in automotive applications?
Operating the BAV101 near 175°C increases long-term reliability risks, especially in underhood automotive electronics where thermal cycling is frequent. At elevated temperatures, the 5 µA reverse leakage current can accelerate wearout mechanisms such as electromigration or interface degradation, reducing operational lifespan. The MINI-MELF package lacks leads, making it more susceptible to solder joint fatigue under thermal stress. To mitigate risk, derate the device by 20–30% in power dissipation, use thermal vias under the PCB land pattern, and avoid placement near high-heat components. Accelerated life testing is recommended for mission-critical designs.
Is the BAV101 suitable for use in low-leakage sensor conditioning circuits, such as those with high-impedance piezoelectric sensors?
Use caution when integrating the BAV101 in high-impedance sensor interfaces like piezoelectric signal chains, where input leakage must be minimized. The BAV101 specifies 5 µA leakage at 100 V, which may rise significantly at elevated temperatures—potentially introducing offset errors or noise. Compare with lower-leakage alternatives such as the 1N4148W (typically <0.1 µA @ 20 V) or specialized diodes like the SMS1498. If using the BAV101, operate it well below rated voltage (e.g., <50 V) and temperature, and guard the node with a PCB ground ring to shunt leakage current away from sensitive inputs.
How does the MINI-MELF package of the BAV101 impact manufacturability and thermal performance compared to SOD-123 packaged diodes like the BAV99?
The DO-213AA MINI-MELF package of the BAV101 offers better power dissipation and thermal stability vs. smaller plastic packages like SOD-123 (used by BAV99), due to its ceramic body and higher thermal mass. However, MINI-MELF components present pick-and-place challenges—rounded shape increases roll risk during solder paste printing and reflow if pad design is suboptimal. Implement elongated pads with solder dams to secure placement. While thermal resistance is better than SOD-123, the lack of a lead frame limits heat spreading. For high-density boards where automation yield is critical, verify with your assembly house that BAV101 placement processes are qualified to avoid tombstoning or misalignment.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
BAV101 CAD Models
Diotec Semiconductor BAV101 PCB symbols & footprints
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