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AON7404G
Alpha & Omega Semiconductor Inc.
MOSFET N-CH 20V 20A/20A 8DFN
120321 Pcs New Original In Stock
N-Channel 20 V 20A (Ta), 20A (Tc) 5W (Ta), 28W (Tc) Surface Mount 8-DFN-EP (3x3)
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5.0 / 5.0
- (236 Ratings)
AON7404G
Product Overview
13270528
DiGi Electronics Part Number
AON7404G-DGManufacturer
Alpha & Omega Semiconductor Inc.
AON7404G
Description
MOSFET N-CH 20V 20A/20A 8DFNInventory
120321 Pcs New Original In Stock
N-Channel 20 V 20A (Ta), 20A (Tc) 5W (Ta), 28W (Tc) Surface Mount 8-DFN-EP (3x3)
Quantity
Minimum 1
Minimum 1
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AON7404G Technical Specifications
Category
Transistors, FETs, MOSFETs, Single FETs, MOSFETs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
FET Type
N-Channel
Technology
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)
20 V
Current - Continuous Drain (Id) @ 25°C
20A (Ta), 20A (Tc)
Drive Voltage (Max Rds On, Min Rds On)
2.5V, 4.5V
Rds On (Max) @ Id, Vgs
5.3mOhm @ 20A, 4.5V
Vgs(th) (Max) @ Id
1.25V @ 250µA
Gate Charge (Qg) (Max) @ Vgs
45 nC @ 4.5 V
Vgs (Max)
±12V
Input Capacitance (Ciss) (Max) @ Vds
3300 pF @ 10 V
FET Feature
-
Power Dissipation (Max)
5W (Ta), 28W (Tc)
Operating Temperature
-55°C ~ 150°C (TJ)
Mounting Type
Surface Mount
Supplier Device Package
8-DFN-EP (3x3)
Package / Case
8-PowerVDFN
Base Product Number
AON740
Datasheet & Documents
HTML Datasheet
AON7404G-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.29.0095
Additional Information
Other Names
785-AON7404GTR
5202-AON7404GTR
785-AON7404GCT
785-AON7404GDKR
Standard Package
5,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
грудня 02, 2025
하루하루 오래 사용할 수 있을 만큼 내구성이 뛰어나고, 포장도 섬세하게 되어 있어 안심하고 주문했어요.
грудня 02, 2025
Ich wurde regelmäßig über den Versandstatus informiert, was mein Einkaufserlebnis bei DiGi Electronics sehr angenehmer machte.
грудня 02, 2025
Their after-sales service is exceptional, providing me with reassurance.
грудня 02, 2025
The consistency and reliability of their product quality make them an excellent partner for electronics prototyping.
грудня 02, 2025
Their logistics team is efficient, ensuring our orders arrive precisely when needed.
грудня 02, 2025
They make online shopping cost-effective and straightforward.
грудня 02, 2025
I appreciated how quickly my order shipped. DiGi Electronics always ensures timely delivery, which is crucial for my projects.
грудня 02, 2025
The customer service from DiGi Electronics is outstanding and always helpful.
грудня 02, 2025
I am impressed by the consistent quality of their offerings.
грудня 02, 2025
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Frequently Asked Questions (FAQ)
Can the AON7404G be safely used as a drop-in replacement for the Infineon BSC050N03LS G in a 12V DC-DC buck converter, and what layout or thermal considerations must be addressed?
The AON7404G is a viable replacement for the Infineon BSC050N03LS G in 12V buck applications due to its lower Rds(on) (5.3mΩ vs. 5.0mΩ) and compatible 20V Vdss rating. However, the AON7404G’s 8-DFN-EP (3x3) package has a smaller footprint and different pad geometry, requiring PCB layout adjustments—especially for the exposed thermal pad, which must be properly soldered to a sufficiently sized ground plane for heat dissipation. Unlike the BSC050N03LS G’s TO-220-style thermal performance, the AON7404G relies heavily on PCB copper for cooling; without adequate thermal vias and copper area, junction temperatures may exceed safe limits under continuous 20A loads, risking thermal runaway.
What are the risks of driving the AON7404G with a 3.3V logic-level gate driver in a high-frequency switching application, and how can shoot-through or slow turn-on be mitigated?
Driving the AON7404G with a 3.3V gate signal risks incomplete turn-on because its Vgs(th) max is 1.25V, but Rds(on) is only guaranteed at 4.5V—at 3.3V, conduction losses increase significantly, leading to higher junction temperatures. In high-frequency designs (e.g., >100kHz), this also increases switching losses due to slower dv/dt and di/dt transitions, raising the risk of shoot-through in half-bridge configurations. To mitigate this, use a dedicated gate driver IC (e.g., TI UCC27517) to boost gate voltage to 4.5V or higher, and ensure tight control of dead time. Additionally, place the driver close to the AON7404G to minimize loop inductance and avoid parasitic oscillations.
How does the AON7404G’s thermal performance compare to the Vishay SiZF400DT in a 5W ambient-power application without a heatsink, and what PCB design practices maximize reliability?
In a 5W ambient-power scenario without a heatsink, the AON7404G outperforms the Vishay SiZF400DT due to its lower Rds(on) and more efficient 8-DFN-EP package, which enables better heat spreading through the PCB. However, both devices rely on copper area for cooling—without at least 2 in² of 2-oz copper connected to the exposed pad and multiple thermal vias (≥9 vias of 0.3mm diameter), the AON7404G’s TJ can exceed 125°C under sustained load, accelerating aging. To maximize reliability, use a symmetrical copper pour on both top and inner layers, avoid thermal reliefs on the drain/source pads, and validate thermal performance with infrared imaging or thermocouple testing under worst-case conditions.
Is the AON7404G suitable for parallel operation in a high-current motor drive application, and what matching and layout precautions are necessary to prevent current imbalance?
The AON7404G can be used in parallel for high-current motor drives, but current sharing must be carefully managed due to its positive temperature coefficient of Rds(on), which helps stabilize sharing at high temps—yet initial mismatch at cold start can cause one device to carry disproportionate current. To ensure balance, use tightly matched gate resistors (≤1% tolerance), identical trace lengths from driver to each gate, and a common Kelvin source connection. Avoid daisy-chaining source connections; instead, use a star topology. Additionally, monitor individual device temperatures during prototyping—uneven heating indicates layout asymmetry or gate drive imbalance, which can lead to premature failure of the AON7404G under repetitive surge conditions.
What long-term reliability concerns should be considered when using the AON7404G in an industrial environment with ambient temperatures cycling between -40°C and 85°C, especially regarding solder joint fatigue and MSL rating?
The AON7404G’s MSL 1 rating means it’s immune to moisture-induced defects during assembly, but long-term reliability in thermal cycling environments depends heavily on PCB mounting integrity. The 8-DFN-EP package has a small soldering area, making it susceptible to solder joint fatigue under repeated -40°C to 85°C cycles, especially if the CTE mismatch between the PCB and package isn’t managed. To mitigate this, use a rigid FR4 or high-Tg substrate with balanced copper distribution, avoid placing the AON7404G near board edges or stiffeners, and consider underfill for mission-critical applications. Additionally, ensure reflow profiles comply with JEDEC J-STD-020 to prevent voiding under the thermal pad, which would degrade thermal performance and accelerate localized heating over time.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
AON7404G CAD Models
Alpha & Omega Semiconductor Inc. AON7404G PCB symbols & footprints
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