AO4402G >
AO4402G
Alpha & Omega Semiconductor Inc.
MOSFET N-CH 20V 20A 8SOIC
27339 Pcs New Original In Stock
N-Channel 20 V 20A (Ta) 3.1W (Ta) Surface Mount 8-SOIC
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AO4402G Alpha & Omega Semiconductor Inc.
5.0 / 5.0 - (26 Ratings)

AO4402G

Product Overview

13270536

DiGi Electronics Part Number

AO4402G-DG
AO4402G

Description

MOSFET N-CH 20V 20A 8SOIC

Inventory

27339 Pcs New Original In Stock
N-Channel 20 V 20A (Ta) 3.1W (Ta) Surface Mount 8-SOIC
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 5 0.3439 1.7195
  • 50 0.2753 13.7650
  • 150 0.2460 36.9000
  • 500 0.2092 104.6000
  • 3000 0.1711 513.3000
  • 6000 0.1613 967.8000
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AO4402G Technical Specifications

Category Transistors, FETs, MOSFETs, Single FETs, MOSFETs

Packaging Tape & Reel (TR)

Series -

Product Status Active

FET Type N-Channel

Technology MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss) 20 V

Current - Continuous Drain (Id) @ 25°C 20A (Ta)

Drive Voltage (Max Rds On, Min Rds On) 2.5V, 4.5V

Rds On (Max) @ Id, Vgs 5.9mOhm @ 20A, 4.5V

Vgs(th) (Max) @ Id 1.25V @ 250µA

Gate Charge (Qg) (Max) @ Vgs 45 nC @ 4.5 V

Vgs (Max) ±12V

Input Capacitance (Ciss) (Max) @ Vds 3300 pF @ 10 V

FET Feature -

Power Dissipation (Max) 3.1W (Ta)

Operating Temperature -55°C ~ 150°C (TJ)

Mounting Type Surface Mount

Supplier Device Package 8-SOIC

Package / Case 8-SOIC (0.154", 3.90mm Width)

Base Product Number AO44

Datasheet & Documents

HTML Datasheet

AO4402G-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.29.0095

Additional Information

Other Names
785-AO4402GTR
5202-AO4402GTR
Standard Package
3,000

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
AO4402
Alpha & Omega Semiconductor Inc.
180474
AO4402-DG
0.1613
MFR Recommended

Reviews

5.0/5.0-(Show up to 5 Ratings)
Hirs***üter
грудня 02, 2025
5.0
Ich bin sehr zufrieden mit der prompten Reaktionsfähigkeit und der hervorragenden Qualität der Produkte bei DiGi Electronics.
Lun***low
грудня 02, 2025
5.0
The efficiency of DiGi Electronics' delivery system keeps our supply chain running smoothly.
Summ***reeze
грудня 02, 2025
5.0
Their after-sales team went above and beyond to assist with any post-purchase inquiries, which was very reassuring.
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Frequently Asked Questions (FAQ)

Can the AO4402G be reliably used in battery-powered portable devices operating near 2V gate drive, and what risks should I consider in low-voltage switching applications?

Yes, the AO4402G can operate with gate voltages as low as 2.5V, making it suitable for battery-powered systems where the controller output may droop below 3V. However, at 2.5V Vgs, the Rds(on) increases to about 8.5mΩ (typical), which is above the 5.9mΩ spec at 4.5V. Designers should verify thermal performance under maximum load current (20A) to avoid overheating due to higher conduction losses. In pulse-width modulated (PWM) applications, ensure the driver can source/sink 45nC quickly to minimize switching losses, particularly as low gate drive slows turn-on. Consider adding a gate resistor (5–10Ω) to damp ringing, especially in high di/dt layouts.

Is the AO4402G a suitable drop-in replacement for the SiSS098DN or Infineon BSC023N04LS6 in a 20V load switch design, and how do their switching performances compare?

The AO4402G can serve as a functional replacement for the SiSS098DN and BSC023N04LS6 in 20V load switching, but careful review of key differences is required. Compared to the SiSS098DN (Rds(on): 9.8mΩ @ 4.5V), the AO4402G offers lower on-resistance (5.9mΩ) and higher current capacity (20A vs 15A), improving efficiency. Against the BSC023N04LS6 (Rds(on): 2.3mΩ), the AO4402G has higher Rds(on) but integrates better EMI performance due to lower gate charge (45nC vs ~65nC). However, the BSC023N04LS6 uses a PowerPAK package with superior thermal dissipation; thus, on FR4 boards with limited copper, thermal vias and ²"²" copper pour are recommended when using AO4402G to match thermal performance.

What are the thermal design challenges when operating the AO4402G at full 20A current in an 8-SOIC package without a heatsink?

Operating the AO4402G at 20A continuously in an 8-SOIC package poses significant thermal risks due to its 3.1W power dissipation limit at ambient temperature. At 5.9mΩ Rds(on), conduction loss alone reaches 2.36W (I²R) at 20A, leaving minimal headroom for switching losses. Without a heatsink, junction temperature can exceed 150°C—even at moderate ambient temperatures—unless thermal management is optimized. Use at least 1 in² of 2oz copper on the drain pad connected through multiple thermal vias to an inner ground plane. Consider pulsed operation or current derating above 60°C ambient. Thermal monitoring during prototyping is strongly advised.

How does the high input capacitance (Ciss: 3300 pF) of the AO4402G impact high-frequency switching designs, and what driver considerations are necessary?

The AO4402G’s high Ciss (3300 pF @ 10V) increases gate charge demand, especially at higher switching frequencies (e.g., >100 kHz). With Qg up to 45nC @ 4.5V, the driver must supply peak currents exceeding 180mA at 100kHz (for 250ns rise time), which exceeds the capability of many microcontroller GPIOs. Use a dedicated gate driver IC (e.g., TC4420 or MIC5018) to ensure fast turn-on/off and minimize cross-conduction losses. Also, PCB layout should minimize gate loop inductance with short, direct traces and a low-impedance return path to prevent voltage overshoot on the gate, which could exceed the ±12V Vgs(max) limit during transients.

What are the long-term reliability risks of using the AO4402G in automotive environments with wide temperature swings, and how can I mitigate them?

While the AO4402G supports a junction temperature range of -55°C to 150°C and is suitable for automotive underhood use, long-term reliability depends on proper stress derating. Avoid sustained operation above 130°C TJ to reduce electromigration and thermal cycling fatigue, especially given the plastic 8-SOIC package’s CTE mismatch with PCBs. Implement design margins: limit max current to 15A instead of 20A, use 2-layer or 4-layer boards with robust copper, and avoid placing near heat sources like transformers. Confirm MSL 1 status allows for reflow without baking, but store in dry conditions to prevent popcorning. Conduct HALT testing if deployed in harsh duty cycles.

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